SUSS MICROTEC AG

C4NP

Computer hardware and computer software for use in the manufacture of semi-conductors and microstructure elements such as wafers and glass templates used in the manufacture of semi-conductors;Machines, using solder bumping technology, for use in the manufacture of semi-conductors and microstructure elements such as wafers and glass templates used in the manufacture of semi-conductors;Maintenance, repair and installation of machines for the manufacture of semi-conductors and microstructure elements such as wafers and glass templates used in the manufacture of semi-conductors;C FOUR NP C FOR NP;

CAP COAT

machines for uniformly applying thin wet films to panels and planar substrates of glass, plastic and metal, namely spin coaters, meniscus coaters, roller coaters, extrusion coaters, flex printers, and curtain coaters;construction and installation of varnishing and coating machines for others;design of varnishing and coating machines for others;

HAMATECH

machines for the semiconductor industry [ and the industry of the optical information storage media and of optical display devices; namely, machines for the lacquering and coating of substrates and disks, machines for the hardening of coatings and lacquers ], machines for the cleaning of substrates, [ disks, ] and of masks for semiconductor manufacturing; machines for the inspection of substrates [ and disks ], machines for the development of irradiated substrates; machines for the etching of layers on substrates; manual and automatic handling units and components therefor; supply and preparation units for fluids and gases; [ machines for the manufacturing, lacquering, and coating of optical information storage media; ] and components of the aforementioned goods; computer programs for use in the field of semiconductor manufacturing data processing equipment; namely, microprocessors used for semiconductor process control and components of the aforementioned goods;[ technical advisory services relating to planning and construction of production facilities for the semiconductor industry, the industry of optical information data storage media, and the optical display industry, including manufacturers of CD's (compact discs), LCD's (liquid crystal displays) and LCTV's (liquid crystal televisions) ];Halbleiter means semiconductor and Maschinenbau means machine-building.;

KSM KARL SUSS

Optical, Electrical, Electronic, and Mechanical Instruments-Namely, Mask-Aligning Apparatuses, Scribing Apparatuses, and Wafer Probers for Making Semiconductor Devices;

MODU TRACK

Mechanical apparatus for the manufacturing of substrates, namely semiconductor substrates, silicon chips, wafers, and glass and ceramic substrates; and parts thereof; machines for wet-chemical and dry treatment of substrates, namely semiconductor substrates, silicon chips, wafers, glass and ceramic substrates; and parts thereof; fully automatic apparatus and equipments comprised thereof for cleaning lacquering, developing, etching and stripping substrates, baking, drying and treatment by IN, visible, or IR light irradiation of substrates, namely semiconductor substrates, silicon chips, wafers, glass and ceramic substrates, and parts thereof; semiautomatic apparatus, namely manual insertion and removal apparatus for cleaning, lacquering, developing, etching and stripping substrates, baking, drying and treatment by IN, visible, or IR light irradiation of substrates, namely semiconductor substrates, silicon chips, wafers, photo masks, glass and ceramic substrates, and parts thereof;Installation, maintenance, repair, process adjustment and optimization of mechanical apparatus for the manufacturing of substrates, namely semiconductor substrates, silicon chips, wafers, photomasks, glass and ceramic substrates, and parts thereof; installation, maintenance, repair, process adjustment and optimization of machines for wet-chemical and dry treatment, and semiautomatic apparatus, and manual insertion and removal apparatus for cleaning, lacquering, developing, etching, stripping, baking, drying and treatment by UV, visible, or IR light radiation of substrates at the customers location;

SUPRAYIELD

Optical, electric and electronic equipment for the processing and testing of electronic, micromechanical and optomechanical components and in particular semi-conductors and micromechanical components in the nature of mask adjusting devices, wafer samplers, bonders, coaters and interlinked systems, namely mask aligners comprising eye-pieces or dual video, microscopes and monitors, lithography clusters comprising mask aligner modules linked to a spin-coating apparatus designed for wafer bumping and wafer level packaging, bonders comprising center push-ins, disposable and exchangeable plates, electrodes, monitors; cleaners, comprising megasonic nozzles and optical-chemical cleaners, chucks, infra-red light sources, CCD camera; wafer mounting apparatus, comprising process modules which can be used for processes such as pre-cleaning, adhesive coating, heating, wafer mounting, cooling and final cleaning; probed apparatus equipped with a laser cutter or emission microscopes and working with software; test devices for opto-electronics comprising special fiber positioning apparatus, integrating spheres, chuck fixtures for laser bar handling, graphical user interfaces, physical sensors, accelerometers and microphones, software and flexible tools for pattern recognition;Machines for the production of electronic, micromechanical and optical components;Installation, repair and maintenance of the machines for the production, processing and testing of electronic, micromechanical and optical components, and of the optical, electrical and electronic equipment for the production, processing and testing of electronic, micromechanical and optomechanical components and, in particular, semi-conductors and micromechanical components in the nature of mask adjusting devices, wafer samplers, bonders, coaters, and interlinked systems, namely mask aligners comprising eye-pieces or dual video, microscopes and monitors, lithography clusters comprising mask aligner modules linked to a spin-coating apparatus designed for wafer bumping and wafer level packaging, bonders comprising center push-ins, disposable and exchangeable plates, electrodes, monitors; installation, repair and maintenance of cleaners, comprising megasonic nozzles and optical-chemical cleaners, chucks, infra-red light sources, CCD camera; installation, repair and maintenance of wafer mounting apparatus, comprising process modules which can be used for processes such as pre-cleaning, adhesive coating, heating, wafer mounting, cooling and final cleaning; installation, repair and maintenance of probed apparatus equipped with a laser cutter or emission microscopes and working with software; installation, repair and maintenance of test devices for opto-electronics comprising special fiber positioning apparatus, integrating spheres, chuck fixtures for laser bar handling, graphical user interfaces, physical sensors, accelerometers and microphones, flexible tools for pattern recognition;SUPRA YIELD;Technical support services, namely, development of new technology for others in the field of microtechnology; design and testing for new product development; installation and maintenance of software for pattern recognition;

SUSS MICROTEC

Color appears in the mark as follows: the letters and plus sign are blue, and the box encompassing the letters SUSS is orange, there being no black in the mark.;optical, electric and electronic equipment for the production, processing and testing of electronic, micromechanical and optomechanical components and in particular semi-conductors and micromechanical components in the nature of mask adjusting devices, wafer samplers, bonders, coaters, and interlinked systems, namely, mask aligners comprising eye-pieces or dual video, microscopes and monitors, lithography clusters comprising mask aligner modules linked to a spin-coating apparatus designed for wafer bumping and wafer level packaging, bonders comprising centre push-ins, disposable and exchangeable plates, electrodes, monitors; cleaners, comprising megasonic nozzles and optical-chemical cleaners, chucks, infra-red light sources, CCD camera; wafer mounting apparatus, comprising process modules which can be used for processes such as pre-cleaning, adhesive coating, heating, wafer mounting, cooling and final cleaning; probed apparatus equipped with a laser cutter or emission microscopes and working with software; test devices for opto-electronics comprising special fiber positioning apparatus, integrating spheres, chuck fixtures for laser bar handling, graphical user interfaces, physical sensors, accelerometers and microphones, software and flexible tools for pattern recognition;machines for the production, processing and testing of electronic, micromechanical and optical components;[ installation, repair and maintenance of the machines for the production, processing and testing of electronic, micromechanical and optical components, and of the optical, electrical and electronic equipment for the production, processing and testing of electronic, micromechanical and optomechanical components and, in particular, semi-conductors and micromechanical components in the nature of mask adjusting devices, wafer samplers, bonders, coaters, and interlinked systems, namely, mask aligners comprising eye-pieces or dual video, microscopes and monitors, lithography clusters comprising mask aligner modules linked to a spin-coating apparatus designed for wafer bumping and wafer level packaging, bonders comprising centre push-ins, disposable and exchangeable plates, electrodes, monitors; cleaners, comprising megasonic nozzles and optical-chemical cleaners, chucks, infra-red light sources, CCD camera; wafer mounting apparatus, comprising process modules which can be used for processes such as pre-cleaning, adhesive coating, heating, wafer mounting, cooling and final cleaning; probed apparatus equipped with a laser cutter or emission microscopes and working with software; test devices for optoelectronics comprising special fiber positioning apparatus, integrating spheres, chuck fixtures for laser bar handling, graphical user interfaces, physical sensors, accelerometers and microphones, software and flexible tools for pattern recognition; installation, maintenance, upgrading, repair of goods in the field of microtechnology ];Color is not claimed as a feature of the mark.;The English translation of the word SUSS in the mark is sweet.;[ Technical support services, namely, development of new technology for others in the field of microtechnology; design and testing for new product development ];

TAMARACK SCIENTIFIC

The mark consists of a blue sunburst to the left of the wording TAMARACK over SCIENTIFIC, both words also being in blue.;Lasers for industrial use; Laser steppers, namely, excimer Laser Steppers for ablating and exposing semiconductors; microelectronic components, namely, semiconductors, MEMS (Micro-Electronic-Mechanical Systems), wafers, interface cards and circuit boards; photolithography apparatus consisting of mask aligners and coaters for the production of components for compound semiconductor, wafer-level packaging, sensors or chips; MEMS (Micro-Electronic-Mechanical Systems) devices, namely, sensors, actors and control electronics on a substrate or chip; mask aligners, namely, masks to be placed on semiconductor wafers for the transfer of a pattern onto the wafer; projection devices, namely, projection scanners; UV light lamps, namely, electrical lights for use in professional quality photography;Machines for use in the microelectronic, semiconductor manufacturing and photolithography industry, for the manufacturing and processing of semiconductor wafers;The color(s) blue is/are claimed as a feature of the mark.;SCIENTIFIC;