TAIYO HOLDINGS CO., LTD.

AUS

Inks for use in the process of producing printed circuit boards, namely, printing inks, marking inks, inks for hole plugging, and solder resist inks, namely, inks for coating or printing in the process of producing package application boards, inks for coating or printing in the process of producing flexible printed boards and inks for coating or printing in the process of producing display panels, namely, plastic package substrate alkaline developable solder resist inks, plastic package substrate solder resist inks, package substrate solder resist inks, alkaline developable solder resist inks, CSP developable solder resist inks, and BGA developable solder resist inks;

CELLFIL

Electrical insulating resists, namely, electrical insulating materials in the liquid form for use in the process of producing printed circuit boards; electrical insulating materials, namely, insulating resin materials for use in the process of producing printed circuit boards; electrical insulating materials, namely, insulating resin materials for use in the process of producing electronic components; electrical insulating materials, namely, insulating resin materials for interlayer dielectric materials in the liquid form for use in the process of producing build-up boards; electrical insulating materials, namely, insulating resin materials for interlayer dielectric materials in the liquid form for sealing electronic components; electrical insulating materials, namely, insulating resin materials for interlayer dielectric materials for use in the process of producing build-up boards; electrical insulating materials, namely, insulating resin materials for interlayer dielectric materials for sealing electronic components; electrical insulating materials, namely, insulating resin materials for interlayer dielectric materials in the form of film for use in the process of producing build-up boards; electrical insulating materials, namely, insulating resin materials for interlayer dielectric materials in the form of film for sealing electronic components; electrical insulating materials, namely, insulating coating materials for use in the process of producing printed circuit boards; electrical insulating materials, namely, insulating coating materials for use in the process of producing display panels; electrical insulating materials, namely, insulating coating materials for protecting copper foil on the surface of printed circuit boards; electrical insulating materials, namely, insulating coating materials for use in the process of producing package application boards; electrical insulating materials, namely, insulating coating materials for use in the process of producing flexible printed circuit boards; insulating fillers, namely, electrical insulating materials for protecting copper foil used with holes of printed circuit boards; electrical insulating materials for sealing electronic components; electrical insulating materials, namely, insulating resin materials for sealing electronic components; electrical insulating materials for use in the process of producing printed circuit boards; semi-processed plastics;Dyes, namely, synthetic dyes; pigments; paints for blocking light; marking inks in the nature of printing inks for use in the process of producing printed circuit boards; marking inks being printing inks for use in the process of producing electronic components; inks for hole plugging, namely, printing inks for use in the process of producing printed circuit boards; paints for sealing electronic components; heat-resistant paints; paints; printing inks for use in the process of producing printed circuit boards; printing inks for use in the process of producing electronic components; printing ink;Chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of solder mask; chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of photoresists; chemicals for use in the process of producing printed circuit boards, namely, solder resists; chemical preparations for use in the process of producing printed circuit boards, namely, solder mask; chemicals for use in the process of producing printed circuit boards, namely, etching resist; chemicals for use in the process of producing printed circuit boards, namely, photoresists; chemical preparations for use in photography; photosensitive resists in the nature of solder mask in the form of film for use in the process of producing printed circuit boards; photosensitive resists in the nature of photoresists in the form of film for use in the process of producing printed circuit boards; photosensitive resists in the form of film for sealing electronic components; unexposed dry films, namely, mold dry films for electronic components; unexposed dry films, namely, insulation mold dry films for electronic components; unexposed dry films, namely, thermal curing type mold dry films for electronic components; chemicals for use in the process of producing printed circuit boards, namely, chemical preparations for blocking light in the color of black in the form of paste for use in the process of forming of black matrix; chemicals for use in the process of producing printed circuit boards, namely, chemical preparations for blocking light; chemical coatings for use in the process of producing printed circuit boards; chemical coatings used in the manufacture of printed circuit boards; chemicals for use in the process of producing printed circuit boards, namely, chemical agents for plugging holes on printed circuit boards; chemical sealants for use in the process of producing electronic components; synthetic resins that are used as sealants for use in the process of producing electronic components; chemical preparations for industrial purposes; industrial chemicals; conductive adhesives for industrial purposes; glue and adhesives for industrial purposes;

CHUGAI AMINOL

Dyestuffs; pigments; paints;

FLEXFINER

insulating resin materials for use with printed circuit boards; insulating coating materials for use with printed circuit boards; insulating coating materials for use with package application boards; insulating coating materials for use with flexible printed boards; insulating resin materials for intermediate dielectric materials for use on build-up boards; insulating resin materials for dry film type intermediate dielectric materials for use on build-up boards; coverlay film for use with flexible printed circuits; insulating resin materials for dry film type for use on flexible printed boards;FLEX FINER;coatings used in the manufacture of printed circuit boards, namely, solder resist; photoresists; photoresists, namely, dry film for use with printed circuit boards; chemicals additives for coating materials for use with printed circuit boards; dry film photosensitive polyimide coating agents for use in the manufacture of commercial, industrial and domestic goods; dry film thermosetting polyimide coating agents for use in the manufacture of commercial, industrial and domestic goods;

FOC

Inks for use in the process of producing printed circuit boards, namely, printing inks, and marking inks, namely, inks for coating or printing in the process of producing package application boards, inks for coating or printing in the process of producing flexible printed boards and inks for coating or printing in the process of producing display panels, namely, UV curable inks;

FOC

Electrical insulating materials for insulating coating or printing materials for use in the process of producing printed circuit boards, namely, insulating resin materials for use in the process of producing build-up boards; insulating resin materials for dry film type intermediate dielectric materials for use in the process of producing build-up boards; and insulating coating materials for use in the process of producing display panels, namely, resin, and colored materials;Chemicals for use in the process of producing printed circuit boards, namely, solder mask, and solder resist, namely, UV curable solder resist;

HRP

Coating for insulation in the process of producing printed circuit boards, namely, interlayer insulation material, namely, interlayer insulation material for coating or printing in the process of producing package application boards, interlayer insulation material for coating or printing in the process of producing flexible printed boards and interlayer insulation material for coating or printing in the process of producing display panels, namely, build-up substrate thermal curable interlayer insulation material, build-up substrate interlayer insulation material, and thermal curable interlayer insulation material;Chemicals for use in the process of producing printed circuit boards, namely, interlayer insulation material in the nature of forming dielectric layers for use in the process of producing printed circuit boards, and build-up boards;

HSP

Electrical insulating resists, namely, electrical insulating materials in the liquid form for use in the process of producing printed circuit boards; insulating resin materials for use in the process of producing printed circuit boards; insulating resin materials for use in the process of producing electronic components; insulating resin materials for interlayer dielectric materials in the liquid form for use in the process of producing build-up boards; insulating resin materials for interlayer dielectric materials in the liquid form for sealing electronic components; insulating resin materials for interlayer dielectric materials for use in the process of producing build-up boards; insulating resin materials for interlayer dielectric materials for sealing electronic components; insulating resin materials for interlayer dielectric materials in the form of dry film for use in the process of producing build-up boards; insulating resin materials for interlayer dielectric materials in the form of dry film for sealing electronic components; insulating coating materials for use in the process of producing printed circuit boards; insulating coating materials for use in the process of producing display panels; insulating coating materials for protecting copper foil on the surface of printed circuit boards; insulating coating materials for use in the process of producing package application boards; insulating coating materials for use in the process of producing flexible printed circuit boards; insulating fillers, namely, insulating materials for protecting copper foil used with holes of printed circuit boards; insulating materials for sealing electronic components; insulating resin materials for sealing electronic components; electrical insulating materials for use in the process of producing printed circuit boards; semi-processed plastics; thermally conductive insulating resin materials for electronic components; insulating materials; electrical insulating materials;Dyes for general industrial use; pigments; paints for blocking light; marking inks in the nature of printing inks for use in the process of producing printed circuit boards; marking inks for use in the process of producing electronic components; inks for hole plugging, namely, printing inks for use in the process of producing printed circuit boards; paints for sealing electronic components; heat-resistant paints; paints; printing inks for use in the process of producing printed circuit boards; printing inks for use in the process of producing electronic components; printing ink;Chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of solder mask; chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of photoresists; chemicals for use in the process of producing printed circuit boards, namely, solder resists; chemical preparations for use in the process of producing printed circuit boards, namely, solder mask; etching resist; photoresists; chemical preparations for use in photography; photosensitive resists in the nature of solder mask in the form of film for use in the process of producing printed circuit boards; photosensitive resists in the nature of photoresists in the form of film for use in the process of producing printed circuit boards; dry films for electronic components; photosensitive resists in the form of film for sealing electronic components; insulation dry films for electronic components; thermal curing type dry films for electronic components; chemical preparations for blocking light; chemical coatings for use in the process of producing printed circuit boards; heat resisting materials, namely, heat resisting unprocessed artificial resin for electronic components; chemical preparations for industrial purposes; industrial chemicals; glue and adhesives for industrial purposes; chemical preparations, namely, thermal interface materials for electronic components for use as a filler to enhance the thermal conductivity between components;

I J P R

Liquid electrical insulating materials for use with printed circuit boards; insulating resin materials for use with printed circuit boards; insulating coating materials for use with printed circuit boards; insulating coating materials for use with package application boards; insulating coating materials for use with flexible printed boards;Inks for use in the process of producing printed circuit boards, namely, marking inks, printing inks, hole plugging inks and solder resist inks;Chemicals for use in the process of producing printed circuit boards, namely, solder resists; photoresists; chemicals, namely, photosensitive resists used in the manufacture of printed circuit boards; chemical coatings used in the manufacture of printed circuit boards;

IJSR

Electrical insulating resists, namely, electrical insulating materials in the liquid form for use in the process of producing printed circuit boards; electrical insulating materials, namely, insulating resin materials for use in the process of producing printed circuit boards; electrical insulating materials, namely, insulating coating materials for use in the process of producing printed circuit boards; electrical insulating materials, namely, insulating coating materials for use in the process of producing package circuit boards; electrical insulating materials, namely, insulating coating materials for use in the process of producing flexible printed circuit boards;Marking inks in the nature of printing inks for use in the process of producing printed circuit boards; inks for hole plugging, namely, printing inks for use in the process of producing printed circuit boards; printing inks for use in the process of producing printed circuit boards;Chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of solder mask; chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of photoresists; chemicals for ink jet printing, namely, resist ink in the nature of solder mask; chemicals for ink jet printing, namely, resist ink in the nature of photoresists; chemicals for use in the process of producing printed circuit boards, namely, solder resists; chemicals for use in the process of producing printed circuit boards, namely, photoresists; photosensitive resists in the nature of solder mask in the form of film for use in the process of producing printed circuit boards; chemical coatings for use in the process of producing printed circuit boards;

MICROSEAL

Electrical insulating resists, namely, electrical insulating materials in the liquid form for use in the process of producing printed circuit boards; electrical insulating materials, namely, insulating resin materials for use in the process of producing printed circuit boards; electrical insulating materials, namely, insulating resin materials for use in the process of producing optical electronics components; electrical insulating materials, namely, insulating resin materials for interlayer dielectric materials in the liquid form for use in the process of producing build-up boards; electrical insulating materials, namely, insulating resin materials for interlayer dielectric materials in the liquid form for sealing optical electronics components; electrical insulating materials, namely, insulating resin materials for interlayer dielectric materials for use in the process of producing build-up boards; electrical insulating materials, namely, insulating resin materials for interlayer dielectric materials for sealing optical electronics components; electrical insulating materials, namely, insulating resin materials for interlayer dielectric materials in the form of film for use in the process of producing build-up boards; electrical insulating materials, namely, insulating resin materials for interlayer dielectric materials in the form of film for sealing optical electronics components; electrical insulating materials, namely, insulating coating materials for use in the process of producing printed circuit boards; electrical insulating materials, namely, insulating coating materials for use in the process of producing display panels; electrical insulating materials, namely, insulating coating materials for protecting copper foil on the surface of printed circuit boards; electrical insulating materials, namely, insulating coating materials for use in the process of producing package application boards; electrical insulating materials, namely, insulating coating materials for use in the process of producing flexible printed circuit boards; insulating fillers, namely, electrical insulating materials for protecting copper foil used with holes of printed circuit boards; electrical insulating materials for sealing optical electronics components; electrical insulating materials, namely, insulating resin materials for sealing optical electronics components; electrical insulating materials for use in the process of producing printed circuit boards; semi-processed plastics;MICRO SEAL;Chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of solder mask; chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of photoresists; chemicals for use in the process of producing printed circuit boards, namely, solder resists; chemical preparations for use in the process of producing printed circuit boards, namely, solder mask; chemicals for use in the process of producing printed circuit boards, namely, etching resist; chemicals for use in the process of producing printed circuit boards, namely, photoresists; chemical preparations for use in photography; photosensitive resists in the nature of solder mask in the form of film for use in the process of producing printed circuit boards; photosensitive resists in the nature of photoresists in the form of film for use in the process of producing printed circuit boards; photosensitive resists in the form of film for sealing optical components; unexposed dry films, namely, mold dry films for display; unexposed dry films, namely, mold dry films with optical properties; unexposed dry films, namely, insulation mold dry films for display; unexposed dry films, namely, insulation mold dry films with optical properties; unexposed dry films, namely, mold dry films for display with optical properties; chemicals for use in the process of producing printed circuit boards, namely, chemical preparations for blocking light in the color of black in the form of paste for use in the process of forming of black matrix; chemicals for use in the process of producing printed circuit boards, namely, chemical preparations for blocking light; chemical coatings for use in the process of producing printed circuit boards; chemical coatings used in the manufacture of printed circuit boards; chemicals for use in the process of producing printed circuit boards, namely, chemical agents for plugging holes on printed circuit boards; chemical sealants for use in the process of producing optical electronics components; synthetic resin that are used as sealants in the process of producing optical electronics components; chemical preparations for industrial purposes; industrial chemicals; conductive adhesives for industrial purposes; glue and adhesives for industrial purposes;

NLAYER

Electrical insulating resists, namely, electrical insulating materials in the liquid form for use in the process of producing printed circuit boards; insulating resin materials for use in the process of producing printed circuit boards; insulating resin materials for interlayer dielectric materials in the liquid form for use in the process of producing build-up boards; insulating resin materials for interlayer dielectric materials for use in the process of producing build-up boards; insulating resin materials for interlayer dielectric materials in the form of film for use in the process of producing build-up boards; insulating coating materials for use in the process of producing printed circuit boards; insulating coating materials for use in the process of producing display panels; insulating coating materials for protecting copper foil on the surface of printed circuit boards; insulating coating materials for use in the process of producing package application boards; insulating coating materials for use in the process of producing flexible printed circuit boards; insulating fillers, namely, insulating materials for protecting copper foil used with holes of printed circuit boards; electrical insulating materials for use in the process of producing printed circuit boards; semi-processed plastics;N LAYER;Paints for blocking light; paints for reflecting light; marking inks in the nature of printing inks for use in the process of producing printed circuit boards; inks for hole plugging, namely, printing inks for use in the process of producing printed circuit boards; heat-resistant paints; paints; printing inks for use in the process of producing printed circuit boards; printing ink;Chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of solder mask; chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of photoresists; chemicals for use in the process of producing printed circuit boards, namely, solder resists; chemical preparations for use in the process of producing printed circuit boards, namely, solder mask; photoresists; photosensitive resists in the nature of solder mask in the form of film for use in the process of producing printed circuit boards; photosensitive resists in the nature of photoresists in the form of film for use in the process of producing printed circuit boards; chemical coatings for use in the process of producing printed circuit boards;

PHOTOFINER

The mark consists of a larger rectangle with two rounded sides with two smaller rectangles in the lower right corner of the larger rectangle and the wording PHOTOFINER. The color white appears in the background of the rectangle; the color dark green appears in the outline of the larger rectangle and in the letters P and F in the literal element; the color black appears in the remaining letters, HOTO, INER; the color green appears in one of the smaller rectangles in the lower right corner of the larger rectangle; the color light green appears in the second smaller rectangle in the lower right corner of the larger rectangle.;79025305;PHOTO FINER;The color(s) dark-green, green, light-green, black, and white is/are claimed as a feature of the mark.;Resist ink for use in the manufacture of package application boards in the nature of printed circuit boards; resist ink for use in the manufacture of flexible printed boards in the nature of printed circuit boards; resist ink for use in the manufacture of display panels, namely, liquid crystal and plasma display panels;