Ventec Electronics (Suzhou) Co., Ltd.

AEROLAM

The mark consists of the literal element AEROLAM in stylized text, with the prefix aero appearing in the color blue and lam appearing in the color silver. To the right of the literal element is a fanciful design consisting of four interlocking octagon shapes, with the top two appearing in the color silver, the lower left octagon appearing in grey, and the lower right octagon appearing in blue.;Electrical insulating materials; base materials for use in the manufacture of circuit boards, namely, panels and panel blanks made of reinforcements of glass and combinations of resin materials, namely, Epoxy Resin material, Polyphenylene Ether (PPO) resin material, Polytetrafluoroethylene (PTFE) resin material and Hydrocarbon resin material; base materials for use in the manufacture of multi-layer circuit boards, namely, thin laminates and fibrous material made of reinforcements of glass and combinations of resin materials, namely, Epoxy Resin material, Polyphenylene Ether (PPO) resin material, Polytetrafluoroethylene (PTFE) resin material and Hydrocarbon resin material, fibrous material pre-impregnated with Epoxy Resin material, Polyphenylene Ether (PPO) resin material, Polytetrafluoroethylene (PTFE) resin material and Hydrocarbon resin material; base materials for use in the manufacture of circuit boards, namely, semi-processed plastic; plastic materials in the form of plates and sheets for use in the manufacture of circuit boards;The color(s) blue, silver and grey is/are claimed as a feature of the mark.;Design of electrical insulating materials, base materials for use in the manufacture of circuit boards, namely, panels and panel blanks made of reinforcements of glass and combinations of resin materials, namely, Epoxy Resin material, Polyphenylene Ether (PPO) resin material, Polytetrafluoroethylene (PTFE) resin material and Hydrocarbon resin material, base materials for use in the manufacture of multi-layer circuit boards, namely, thin laminates and fibrous material made of reinforcements of glass and combinations of resin materials, namely, Epoxy Resin material, Polyphenylene Ether (PPO) resin material, Polytetrafluoroethylene (PTFE) resin material and Hydrocarbon resin material, fibrous material pre-impregnated with Epoxy Resin material, Polyphenylene Ether (PPO) resin material, Polytetrafluoroethylene (PTFE) resin material and Hydrocarbon resin material, base materials for use in the manufacture of circuit boards, namely, semi-processed plastic, plastic materials in the form of plates and sheets for use in the manufacture of circuit boards;