THERMOLOOP

Welcome to the Brand page for “THERMOLOOP”, which is offered here for Cutting of materials by abrasion; cutting of metals by abrasion; cutting of materials by means of abrasive wires;cutting machines; cutting machines for working with abrasive wires; cutting machines for processing semiconductor wafers; abrasive wires being parts of machines; abrasive wires for semiconductor wafer cutting being parts of machines; abrasive wires for ceramic material cutting being parts of machines; abrasive wires for sapphire cutting being parts of machines; abrasive wires for silicon carbide cutting being parts of machines; abrasive wires for quartz cutting being parts of machines; abrasive wires for silicon nitride cutting being parts of machines; abrasive wires for aluminum nitride cutting being parts of machines; semiconductor cutting machines; equipment for processing semi-conductor wafers;abrasive wires of metal; abrasive wires with metal core and having at least one abrasive particle layer;.

Its status is currently believed to be active. Its class is unavailable. “THERMOLOOP” is believed to be currently owned by “THERMOCOMPACT”.

Owner:
THERMOCOMPACT
Owner Details
Description:
Cutting of materials by abrasion; cutting of metals by abrasion; cutting of materials by means of abrasive wires;Cutting machines; cutting machines for working with abrasive wires; cutting machines for processing semiconductor wafers; abrasive wires being parts of machines; abrasive wires for semiconductor wafer cutting being parts of machines; abrasive wires for ceramic material cutting being parts of machines; abrasive wires for sapphire cutting being parts of machines; abrasive wires for silicon carbide cutting being parts of machines; abrasive wires for quartz cutting being parts of machines; abrasive wires for silicon nitride cutting being parts of machines; abrasive wires for aluminum nitride cutting being parts of machines; semiconductor cutting machines; equipment for processing semi-conductor wafers;Abrasive wires of metal; abrasive wires with metal core and having at least one abrasive particle layer;
Categories: CUTTING MATERIALS BY ABRASION