Vacuum pressing plate assembly

A dough forming apparatus comprising a lower support frame, a lower pressing platen coupled to the lower support frame, and an upper pressing platen assembly positioned above the lower pressing platen. The upper pressing platen assembly further comprises a backing structure, an upper backing platen coupled to the backing structure, and a pressing plate removably coupled to the upper backing platen by vacuum or electromagnetic means. Means for heating the pressing plate, and shims for adjusting the flatness of the pressing surface are provided. A conveyor supported by the lower support frame is positioned to pass between the lower pressing platen and the upper pressing platen assembly. A method of adjusting the apparatus is also disclosed.