CHEMICALS USED FOR ELECTROLESS METAL

Brand Owner (click to sort) Address Description
CATAPOSIT DDP SPECIALTY ELECTRONIC MATERIALS US 8 400 ARCOLA ROAD COLLEGEVILLE PA 19426 CHEMICALS USED FOR ELECTROLESS METAL PLATING;
CATAPREP DDP SPECIALTY ELECTRONIC MATERIALS US 8 400 ARCOLA ROAD COLLEGEVILLE PA 19426 CHEMICALS USED FOR ELECTROLESS METAL PLATING;
S ROHM AND HAAS COMPANY 400 Arcola Road Collegeville PA 19426 CHEMICALS USED FOR ELECTROLESS METAL PLATING AND LIGHT SENSITIVE CHEMICALS FOR USE AS PHOTORESIST MATERIALS IN SELECTIVE ELECTROLESS METAL PLATING AND CHEMICAL MILLING;
S SHIPLEY COMPANY INC. 2300 WASHINGTON ST. NEWTON MA 02162 CHEMICALS USED FOR ELECTROLESS METAL PLATING AND LIGHT SENSITIVE CHEMICALS FOR USE AS PHOTORESIST MATERIALS IN SELECTIVE ELECTROLESS METAL PLATING AND CHEMICAL MILLING;
S SHIPLEY SHIPLEY COMPANY INC. 2300 WASHINGTON ST. NEWTON MA 02162 CHEMICALS USED FOR ELECTROLESS METAL PLATING AND LIGHT SENSITIVE CHEMICALS FOR USE AS PHOTORESIST MATERIALS IN SELECTIVE ELECTROLESS METAL PLATING AND CHEMICAL MILLING;
SHIPLEY DUPONT ELECTRONICS, INC. 974 CENTRE ROAD WILMINGTON DE 19805 CHEMICALS USED FOR ELECTROLESS METAL PLATING AND LIGHT SENSITIVE CHEMICALS FOR USE AS PHOTORESIST MATERIALS IN SELECTIVE ELECTROLESS METAL PLATING AND CHEMICAL MILLING;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A method of production of a circuit board utilizing electroplating which prevents signal reflection and noise due to unnecessary parts in the circuit patterns when electroplating to form circuit patterns on the board to thereby improve the electrical properties and realize higher density layout of the circuit patterns, including the steps of forming a first electroless plating layer and an overlying first plating resist on a metal foil-clad insulating board, feeding power to the first electroless plating layer to form a first electroplating layer over the first electroless plating layer in resist openings; removing the first plating resist; removing the exposed first electroless plating layer and metal foil to expose the insulating board; forming a second electroless plating layer over the exposed parts of the board and the circuit patterns; forming a second plating resist over that; removing the second electroless plating layer at the resist openings; feeding power to the second electroless plating layer under the second plating resist to form a second electroplating layer over the circuit patterns in the resist openings; removing the second plating resist; and removing the exposed second electroless plating layer.