CUTTING MACHINES SEMICONDUCTOR

Brand Owner Address Description
DISCO DISCO CORPORATION 13-11, Omori-Kita 2-chome, Ota-ku Tokyo 143-8580 Japan Cutting machines for semiconductor, glass and ceramic wafers; grinding machines for semiconductor, glass and ceramic wafers; polishing machines for semiconductor, glass and ceramic wafers; metalworking machines utilizing laser beams for cutting; machine tools for cutting namely, cutting blades; machine grinding tools for grinding machines; machine polishing tools for polishing machines [ ; chemical processing machines and apparatus, namely, etching machines and evaporating machines, all for chemical processing; semiconductor manufacturing machines and machine systems ];
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. Woodworking machines including cutting tools and motors adapted to drive the cutting tools are disclosed. The machines also include a detection system adapted to detect a dangerous condition between the cutting tool and a person, and a reaction system adapted to perform a specified action upon detection of the dangerous condition. The machines further include a control system adapted to test the operability of at least a portion of the detection system and/or the reaction system. The control system is adapted to disable the motor if the tested portion is inoperable. The control system also includes a test mode to test whether the detection system is working, to test whether various materials would be detected by the detection system, and/or to test whether various materials would trigger the reaction system.