DISCO CORPORATION

CC FILTER

Filter cartridges for coolant used in cutting machines, grinding machines and other metalworking machines;CARTRIDGE COOLANT FILTER;Color is not claimed as a feature of the mark.;FILTER;

CONDOX

Sheets applicable to surfaces of semiconductor wafers to protect an applied-to surface while another surface is being processed; films applicable to surfaces of semiconductor wafers to protect an applied-to surface while another surface is being processed; plastic tapes for protecting surfaces of semiconductor wafers;CONDO X;

D-ION

Cartridges including ion-exchange resins for deionizing water so as to produce purified water;

DFX

Semiconductor wafer processing machines, namely, machines for stretching a plastic film to which a semiconductor wafer weakened along a number of cutting lines is adhered to thereby cut the semiconductor wafer along the cutting lines; semiconductor manufacturing machines;

DISCO

METAL GRINDING, CUTTING MACHINES, DICING AND SLICING MACHINES; TAPE MOUNTING MACHINES; ABRASIVE BLADES AND WHEELS, AND DRESSERS THEREFOR; AND PARTS FOR THE FOREGOING ITEMS;

DISCO

cutting, slicing, dicing and sawing machines, grinding machines, sharpening machines, and parts therefor; abrasive wheels, dresser for blades and wheels, diamond cutting tools, sold as a unit;

DISCO

semiconductor furnace and chemical vapor deposition units, and automatic semiconductor wafer mounter, sold as a unit;

DISCO

Cutting machines for semiconductor, glass and ceramic wafers; grinding machines for semiconductor, glass and ceramic wafers; polishing machines for semiconductor, glass and ceramic wafers; metalworking machines utilizing laser beams for cutting; machine tools for cutting namely, cutting blades; machine grinding tools for grinding machines; machine polishing tools for polishing machines [ ; chemical processing machines and apparatus, namely, etching machines and evaporating machines, all for chemical processing; semiconductor manufacturing machines and machine systems ];

GLUFREE

Processing of semiconductor wafers; rental of semiconductor wafer manufacturing machines and systems;Metalworking machines, namely, cutting machines, grinding machines, polishing machines; metalworking machine tools; glassware manufacturing machines, namely, glass-working machines and glaziers' diamond; semiconductor manufacturing machines and systems composed of semiconductor wafer dicing machines, semiconductor wafer grinding machines, deionized water recycling units and semiconductor cleaning units; apparatus in the nature of a machine for surface protection processing of semiconductor wafers; apparatus in the nature of a machine for surface protection processing of electronic components;GLUE FREE;

HASEN CUT

Cutting machines utilizing laser beam, metalworking machines and metalworking machine tools, semiconductor manufacturing machines and systems being sold as a unit with the manufacturing machines;CUT;

HOGOMAX

Liquid chemical agents for forming protective films on surfaces of semiconductor wafers;

JETTA

abrasive wheels and diamond cutting tools featuring diamond cutting wheels, blades, and drills and parts therefor;

JETTA

The mark consists of the word JETTA in stylized form.;power operated abrasive wheels and diamond cutting tools; namely, power operated diamond cutting wheels, blades, drills and parts therefor;