ELECTRONIC MODULES INTEGRATING MULTIPLE SEMICONDUCTOR

Brand	Owner	Address	Description
ASIM	Advanced Semiconductor Engineering, Inc.	26, Chin 3rd Road Nantze Export Processing Zone Nantze Kaohsiung 811 Taiwan	Electronic modules integrating multiple semiconductor devices;ADVANCED SEMICONDUCTOR;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

Apparatus and methods are provided for integrating microchannel cooling modules within high-density electronic modules (e.g., chip packages, system-on-a-package modules, etc.,) comprising multiple high-performance IC chips. Electronic modules are designed such that high-performance (high power) IC chips are disposed in close proximity to the integrated cooling module (or cooling plate) for effective heat extraction. Moreover, electronic modules which comprise large surface area silicon carriers with multiple chips face mounted thereon are designed such that integrated silicon cooling modules are rigidly bonded to the back surfaces of such chips to increase the structural integrity of the silicon carriers.