Advanced Semiconductor Engineering, Inc.

A-EASI

Etching processing in the semiconductor wafer; manufacture of semiconductor, Integrated circuit, Integrated circuit board and wafer specified in the standard from customers; semiconductor packaging processing in the nature of manufacturing services for others; etching processing in integrated circuits; semiconductor wafer-level processing; wafer foundry, namely, manufacturing of semiconductor wafers for others; integrated circuit packaging processing in the nature of manufacturing services for others; semiconductor substrate processing and manufacturing; substrate foundry, namely, manufacturing of semiconductor substrates for others; manufacture of semiconductor substrate;Semiconductor device, Product featuring semiconductor package, namely, computer hardware in the nature of wireless access point devices; wafer level package comprising silicon wafers, structured semiconductor wafers, integrated circuits; integrated circuits that contain metal bumps; semiconductor substrate;A-EASY;Semiconductor related products technology research and development for others; Semiconductor packaging design; Integrated Circuit design; semiconductor substrate design; Quality inspection for semiconductors and related products; Testing for semiconductors and related products; quality identification for semiconductors and related products, namely, quality control for others;

A-FCCSP

Processing of materials, namely, silicon wafers and single silicon wafers;The mark consists of the lowercase letter a followed by a hyphen - with an italicized form of fc and capital letters for CSP.;Color is not claimed as a feature of the mark.;Design for others in the field of semiconductor packaging; consulting services in the field of semiconductor electromechanical engineering; design for others in the field of semiconductor packaging; consulting services in the field of semiconductor packaging and testing;

A-QFN

Wafer level and single-wafer technology processing, namely, treatment of semiconductor wafers; semiconductor processing, namely, treatment of semiconductor devices;Semiconductor device, Product featuring semiconductor package, namely, computer hardware in the nature of wireless access point devices, wafer level package comprising silicon wafers, structured semiconductor wafers;Design for others of semiconductor packages, consulting services in the field of semiconductor electro-mechanical engineering;

A-S3

Etching of semiconductor wafers; etching of integrated circuits; manufacture of semiconductors, integrated circuits, integrated circuit boards and structured semi-conductor wafers to the order and specification of others, semiconductor packaging processing to the order and specification of others; semiconductor wafer processing to the order and specification of others; wafer foundry, namely, integrated circuit foundry to the order and specification of others; integrated circuit packaging processing to the order and specification of others;A-S THREE; ADVANCED SEMICONDUCTOR THREE;Research and development for others of semiconductors; semiconductor packaging design; integrated circuit design for others; quality evaluation for others of semiconductors and related products; testing of semiconductors and related products; providing quality assurance in the field of semiconductors and related products;

A-S3

Etching of semiconductor wafers; etching of integrated circuits; manufacture of semiconductors, integrated circuits, integrated circuit boards and structured semi-conductor wafers to the order and specification of others; Semiconductor packaging processing to the order and specification of others in the nature of manufacturing services for others; Wafer foundry, namely, integrated circuit foundry to the order and specification of others; Integrated circuit packaging processing to the order and specification of others in the nature of manufacturing services for others;The mark consists of the letters a and S where there is a dash between the letters and a superscripted number 3 after the S.;ADVANCED SEMICONDUCTOR THREE;Color is not claimed as a feature of the mark.;Research and development for others of semiconductors; semiconductor packaging design; integrated circuit design for others; quality evaluation for others of semiconductors and related products; testing of semiconductors and related products; providing quality assurance in the field of semiconductors and related products;

A-TIV

Etching of semiconductor wafers; Etching of integrated circuits; Manufacturing services for others in the field of semiconductors by wafer-level processing; Manufacturing services for others in the field of semiconductors by using wafer fabricating equipment; Custom manufacturing of semiconductor substrates; Custom manufacture semiconductor devices using substrate fabricating equipment; Manufacturing of semiconductor substrates, semiconductors, integrated circuits, integrated circuit boards, and wafers in accordance with customer specifications;Packaging articles to the order and specification of others, namely, packaging semiconductor chips and integrated circuits;Research and development for others of semiconductor related products and technology; Semiconductor packaging design; Integrated circuit design for others; Design for others of semiconductor substrates carrying integrated circuit; Testing for of semiconductors and related products; Quality management services, namely, quality evaluation and analysis, quality assurance, and quality control, in the field of semiconductors and related products; Providing quality assurance services in the field of semiconductors and related products;

A-WLP

Wafer level and single-wafer technology processing, namely, treatment of semiconductor wafers; Semiconductor processing, namely, treatment of semiconductor devices;Semiconductor devices; Product featuring semiconductor package, namely, computer hardware in the nature of wireless access point devices; Wafer level package comprising silicon wafers, structured semiconductor wafers;Design for others of semiconductor packages; Consulting service in the field of Semiconductor Electro-Mechanical Engineering;

AMAPPOP

Etching of semiconductor wafers; etching of integrated circuits; manufacture of semiconductors, integrated circuits, integrated circuit boards and structured semi-conductor wafers to the order and specification of others, semiconductor packaging processing to the order and specification of others; semiconductor wafer processing to the order and specification of others; wafer foundry, namely, integrated circuit foundry to the order and specification of others; integrated circuit packaging processing to the order and specification of others;Research and development for others of semiconductors; semiconductor packaging design; integrated circuit design for others; quality evaluation for others of semiconductors and related products; testing of semiconductors and related products; providing quality assurance in the field of semiconductors and related products;

AQFN

Wafer level and single-wafer technology processing, namely, treatment of semiconductor wafers; semiconductor processing, namely, treatment of semiconductor devices;Semiconductor device, Product featuring semiconductor package, namely, computer hardware in the nature of wireless access point devices; wafer level package comprising silicon wafers, structured semiconductor wafers;Design for others of semiconductor packages, consulting services in the field of semiconductor electro-mechanical engineering;

ASE

Custom manufacture of semiconductors, semiconductor wafers and integrated circuit boards;Integrated circuit chips; circuit boards; semiconductors; semiconductor devices; integrated circuits; electronic integrated circuits; printed circuit boards; semiconductors chips; integrated circuit boards and semiconductor wafers;ADVANCED SEMICONDUCTOR ENGINEERING;Research and development for others of semiconductors; semiconductor packaging design; integrated circuit design for others; quality evaluation for others of semiconductors and related products; testing of semiconductors and related products; providing quality assurance in the field of semiconductors and related products; consulting in the field of semiconductor packaging technology;

ASIM

Electronic modules integrating multiple semiconductor devices;ADVANCED SEMICONDUCTOR;

ASIM

Custom fabrication of electronic modules, namely, the assembly of semiconductor devices for others;ADVANCED SEMICONDUCTOR;Design of electronic modules for others;

AWLP

Wafer level and single-wafer technology processing, namely, treatment of semiconductor wafers; Semiconductor processing, namely, treatment of semiconductor devices;Semiconductor devices; Product featuring semiconductor package, namely, computer hardware in the nature of wireless access point devices; Wafer level package comprising silicon wafers, structured semiconductor wafers;Design for others of semiconductor packages; Consulting service in the field of Semiconductor Electro-Mechanical Engineering;

ISIP

Wafer level and single-wafer technology processing, namely, treatment of semiconductor wafers; semiconductor processing, namely, treatment of semiconductor devices;Semiconductor device, Product featuring semiconductor package, namely, computer hardware in the nature of wireless access point devices; wafer level package comprising silicon wafers, structured semiconductor wafers;Design for others of semiconductor packages, consulting services in the field of semiconductor electro-mechanical engineering;

IWLP

Wafer level and single-wafer technology processing, namely, treatment of semiconductor wafers; semiconductor processing, namely, treatment of semiconductor devices;Semiconductor device, Product featuring semiconductor package, namely, computer hardware in the nature of wireless access point devices; wafer level package comprising silicon wafers, structured semiconductor wafers;Design for others of semiconductor packages, consulting services in the field of semiconductor electro-mechanical engineering;

MAPPOP

Wafer level and single-wafer technology processing, namely, treatment of semiconductor wafers; Semiconductor processing, namely, treatment of semiconductor devices;Semiconductor devices; Product featuring semiconductor package, namely, computer hardware in the nature of wireless access point devices; Wafer level package comprising silicon wafers, structured semiconductor wafers;MAP POP;Design for others of semiconductor packages; Consulting service in the field of Semiconductor Electro-Mechanical Engineering;

PLLP

Semiconductor chips; Semiconductor devices; Semiconductors;

SIP-ID

Custom manufacture of integrated semiconductor packages in the nature of semiconductor chip housings and semiconductor integrated circuit modules;Custom design, product failure analysis and testing for new product development; technology consultation services regarding semiconductor chip housings and semiconductor integrated circuit modules;

VIPACK

Etching process of semiconductor wafer; semiconductor packaging processing; etching processing of integrated circuits; semiconductor wafer-level processing; wafer foundry; integrated circuit packaging processing; manufacture of substrates, seminconductors, integrated circuits, integrated circuit boards, and wafers specified by the customer;The mark consists of the word VIPACK to the right of various lines.;Color is not claimed as a feature of the mark.;Technology research and development for others in the field of semiconductor related product; integrated circuits design; semiconductor packaging design; substrate design; quality inspection for semiconductors and the related products; testing of semiconductors and the related products; quality identification for semiconductors and the related products; consulting with respect to semiconductor packaging technology;