OPTICAL BASED MEASUREMENT DEVICES

Brand Owner (click to sort) Address Description
CYBEROPTICS CYBEROPTICS CORPORATION 5900 Golden Hills Drive Golden Valley MN 55416 Optical based measurement devices for use in ascertaining the surface features, contour, or shape of an object; optical sensors for high speed dimensional measurements of precision parts; optical sensors for assembling electronics; non-contact optical sensors for assembling electronics; solder paste inspection systems for inspecting and measuring solder paste on circuit boards and software therefor, namely, optical sensors, and associated computer hardware and software; non-contact inspection systems comprised of an optical sensor with a light source, lenses and optical detectors for three-dimensional measurement, used during the manufacturing process of precision parts; machine vision systems comprising component optical sensors and computer hardware and software; manufacturing devices, namely, optical sensors for use in component placement and inspection systems; optical wafer mapping sensors for detecting wafers in wafer processing systems;
CYBEROPTICS CYBEROPTICS CORPORATION 5900 Golden Hills Drive Golden Valley MN 55416 Optical based measurement devices for use in ascertaining the surface features, contour, or shape of an object; optical sensors for high speed dimensional measurements of precision parts; optical sensors for assembling electronics; non-contact optical sensors for assembling electronics; solder paste inspection systems for inspecting and measuring solder paste on circuit boards and software therefor, namely, optical sensors, and associated computer hardware and software; non-contact inspection systems comprised of an optical sensor with a light source, lenses and optical detectors for three-dimensional measurement, used during the manufacturing process of precision parts; machine vision systems comprising component optical sensors and computer hardware and software; manufacturing devices, namely, optical sensors for use in component placement and inspection systems; optical wafer mapping sensors for detecting wafers in wafer processing systems;
EMBEDDED OPTICAL INSPECTION CYBEROPTICS CORPORATION 5900 Golden Hills Drive Golden Valley MN 55416 OPTICAL BASED MEASUREMENT DEVICES FOR USE IN ASCERTAINING THE SURFACE FEATURES, CONTOUR, OR SHAPE OF AN OBJECT; OPTICAL SENSORS FOR HIGH SPEED DIMENSIONAL MEASUREMENTS OF PRECISION PARTS; OPTICAL SENSORS FOR USE IN THE ASSEMBLY OF ELECTRONICS; NON-CONTACT OPTICAL SENSORS FOR USE IN THE ASSEMBLY OF ELECTRONICS; SOLDER PASTE INSPECTION SYSTEMS FOR INSPECTING AND MEASURING SOLDER PASTE ON CIRCUIT BOARDS AND SOFTWARE THEREFOR, NAMELY, OPTICAL SENSORS AND ASSOCIATED COMPUTER HARDWARE AND SOFTWARE; NON-CONTACT INSPECTION SYSTEM COMPRISED OF A SENSOR WITH A LIGHT SOURCE, LENSES AND OPTICAL DETECTORS FOR THREE DIMENSIONAL MEASUREMENT USED DURING THE MANUFACTURING PROCESS OF PRECISION PARTS; MACHINE VISION SYSTEM COMPRISING COMPONENT OPTICAL SENSORS AND COMPUTER HARDWARE AND SOFTWARE; SENSORS FOR USE IN COMPONENT PLACEMENT AND INSPECTION SYSTEMS; OPTICAL WAFER MAPPING SENSORS FOR DETECTING WAFERS IN WAFER PROCESSING SYSTEMS;
EMBEDDED PROCESS VERIFICATION CYBEROPTICS CORPORATION 5900 Golden Hills Drive Golden Valley MN 55416 OPTICAL BASED MEASUREMENT DEVICES FOR USE IN ASCERTAINING THE SURFACE FEATURES, CONTOUR, OR SHAPE OF AN OBJECT; OPTICAL SENSORS FOR HIGH SPEED DIMENSIONAL MEASUREMENTS OF PRECISION PARTS; OPTICAL SENSORS FOR USE IN THE ASSEMBLY OF ELECTRONICS; NON-CONTACT OPTICAL SENSORS FOR USE IN THE ASSEMBLY OF ELECTRONICS; SOLDER PASTE INSPECTION SYSTEMS FOR INSPECTING AND MEASURING SOLDER PASTE ON CIRCUIT BOARDS AND SOFTWARE THERE FOR, NAMELY, OPTICAL SENSORS AND ASSOCIATED COMPUTER HARDWARE AND SOFTWARE; NON-CONTACT INSPECTION SYSTEM COMPRISED OF A SENSOR WITH A LIGHT SOURCE, LENSES AND OPTICAL DETECTORS FOR THREE DIMENSIONAL MEASUREMENT USED DURING THE MANUFACTURING PROCESS OF PRECISION PARTS; MACHINE VISION SYSTEM COMPRISING COMPONENT OPTICAL SENSORS AND COMPUTER HARDWARE AND SOFTWARE; SENSORS FOR USE IN COMPONENT PLACEMENT AND INSPECTION SYSTEMS; OPTICAL WAFER MAPPING SENSORS FOR DETECTING WAFERS IN WAFER PROCESSING SYSTEMS;
EOI CYBEROPTICS CORPORATION 5900 Golden Hills Drive Golden Valley MN 55416 OPTICAL BASED MEASUREMENT DEVICES FOR USE IN ASCERTAINING THE SURFACE FEATURES, CONTOUR, OR SHAPE OF AN OBJECT; OPTICAL SENSORS FOR HIGH SPEED DIMENSIONAL MEASUREMENTS OF PRECISION PARTS; OPTICAL SENSORS FOR USE IN THE ASSEMBLY OF ELECTRONICS; NON-CONTACT OPTICAL SENSORS FOR USE IN THE ASSEMBLY OF ELECTRONICS; SOLDER PASTE INSPECTION SYSTEMS FOR INSPECTING AND MEASURING SOLDER PASTE ON CIRCUIT BOARDS AND SOFTWARE THEREFOR, NAMELY, OPTICAL SENSORS AND ASSOCIATED COMPUTER HARDWARE AND SOFTWARE; NON-CONTACT INSPECTION SYSTEM COMPRISED OF A SENSOR WITH A LIGHT SOURCE, LENSES AND OPTICAL DETECTORS FOR THREE DIMENSIONAL MEASUREMENT USED DURING THE MANUFACTURING PROCESS OF PRECISION PARTS; MACHINE VISION SYSTEM COMPRISING COMPONENT OPTICAL SENSORS AND COMPUTER HARDWARE AND SOFTWARE; SENSORS FOR USE IN COMPONENT PLACEMENT AND INSPECTION SYSTEMS; OPTICAL WAFER MAPPING SENSORS FOR DETECTING WAFERS IN WAFER PROCESSING SYSTEMS;
EPV CYBEROPTICS CORPORATION 5900 Golden Hills Drive Golden Valley MN 55416 OPTICAL BASED MEASUREMENT DEVICES FOR USE IN ASCERTAINING THE SURFACE FEATURES, CONTOUR, OR SHAPE OF AN OBJECT; OPTICAL SENSORS FOR HIGH SPEED DIMENSIONAL MEASUREMENTS OF PRECISION PARTS; OPTICAL SENSORS FOR USE IN THE ASSEMBLY OF ELECTRONICS; NON-CONTACT OPTICAL SENSORS FOR USE IN THE ASSEMBLY OF ELECTRONICS; SOLDER PASTE INSPECTION SYSTEMS FOR INSPECTING AND MEASURING SOLDER PASTE ON CIRCUIT BOARDS AND SOFTWARE THEREFOR, NAMELY, OPTICAL SENSORS AND ASSOCIATED COMPUTER HARDWARE AND SOFTWARE; NON-CONTACT INSPECTION SYSTEM COMPRISED OF A SENSOR WITH A LIGHT SOURCE, LENSES AND OPTICAL DETECTORS FOR THREE DIMENSIONAL MEASUREMENT USED DURING THE MANUFACTURING PROCESS OF PRECISION PARTS; MACHINE VISION SYSTEM COMPRISING COMPONENT OPTICAL SENSORS AND COMPUTER HARDWARE AND SOFTWARE; SENSORS FOR USE IN COMPONENT PLACEMENT AND INSPECTION SYSTEMS; OPTICAL WAFER MAPPING SENSORS FOR DETECTING WAFERS IN WAFER PROCESSING SYSTEMS;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A network performance (e.g., latency and bandwidth) measurement infrastructure for large scale networks based on self-organized probing groups of devices. Each group of devices has a lead device that measures network characteristics, and then shares the measurement information with other devices. This grouping method reduces the amount of network bandwidth needed for adequate measurements, while still providing necessary information to individual devices. The system utilizes a novel multicast-based algorithm that is adopted for both intra-group and inter-group performance measurement. The measurement groups (MeGroups) are dynamic and self-forming, and use a set of heuristic algorithms to optimize the dynamic groupings.