PLASMA ETCHING DEPOSITION SYSTEMS

Brand Owner (click to sort) Address Description
PLASMA TECHNOLOGY PLASMA TECHNOLOGY (UK), LTD. NORTH END, YATTON BRISTOL, AVON BS19 4AP United Kingdom PLASMA ETCHING AND DEPOSITION SYSTEMS, COMPRISING COMPUTERS, MICROPROCESSORS, AUTOMATIC CONTROLS, HIGH VACUUM CHAMBERS AND HIGH VACUUM PUMPING APPARATUS, ELECTRODES AND HIGH FREQUENCY PLASMA GENERATORS AND ASSOCIATED ANALYZERS USED IN THE MANUFACTURER OF INTEGRATED CIRCUITS, ELECTRONIC AND OPTICAL DEVICES;PLASMA;THE LINING (OR STIPPLING) SHOWN IN THE MARK ON THE DRAWING IS A FEATURE OF THE MARK AND DOES NOT INDICATE COLOR.;
PLASMA TECHNOLOGY PLASMA TECHNOLOGY (UK), LTD. NORTH END, YATTON BRISTOL, AVON BS19 4AP United Kingdom PLASMA ETCHING AND DEPOSITION SYSTEMS, COMPRISING COMPUTERS, MICROPROCESSORS, AUTOMATIC CONTROLS, HIGH VACUUM CHAMBERS AND HIGH VACUUM PUMPING APPARATUS, ELECTRODES AND HIGH FREQUENCY PLASMA GENERATORS AND ASSOCIATED ANALYZERS USED IN THE MANUFACTURER OF INTEGRATED CIRCUITS, ELECTRONIC AND OPTICAL DEVICES;PLASMA;THE LINING (OR STIPPLING) SHOWN IN THE MARK ON THE DRAWING IS A FEATURE AND DOES NOT INDICATE COLOR.;
PLASMALAB OXFORD INSTRUMENTS NANOTECHNOLOGY TOOLSLIMITED Tubney Woods Abingdon, Oxon OX13 5QX United Kingdom PLASMA ETCHING AND DEPOSITION SYSTEMS, COMPRISING COMPUTERS, MICROPROCESSORS, AUTOMATIC CONTROLS, HIGH VACUUM CHAMBERS AND HIGH VACUUM PUMPING UNITS, ELECTRODES AND HIGH FREQUENCY PLASMA GENERATORS AND ASSOCIATED ANALYZERS USED IN THE MANUFACTURE OF INTEGRATED CIRCUITS, ELECTRONIC AND OPTICAL EQUIPMENT;PLASMA LABORATORY;
PLASMALAB OXFORD INSTRUMENTS SUPERCONDUCTIVITY LIMITED TUBNEY WOODS ABINGDON, OXON OX13 5QX United Kingdom PLASMA ETCHING AND DEPOSITION SYSTEMS, COMPRISING COMPUTERS, MICROPROCESSORS, AUTOMATIC CONTROLS, HIGH VACUUM CHAMBERS AND HIGH VACUUM PUMPING UNITS, ELECTRODES AND HIGH FREQUENCY PLASMA GENERATORS AND ASSOCIATED ANALYZERS USED IN THE MANUFACTURE OF INTEGRATED CIRCUITS, ELECTRONIC AND OPTICAL EQUIPMENT;PLASMA LABORATORY;
PLASMALAB Oxford Instruments Plasma Technology Limited TUBNEY WOODS ABINGDON, OXON OX135QX PLASMA ETCHING AND DEPOSITION SYSTEMS, COMPRISING COMPUTERS, MICROPROCESSORS, AUTOMATIC CONTROLS, HIGH VACUUM CHAMBERS AND HIGH VACUUM PUMPING UNITS, ELECTRODES AND HIGH FREQUENCY PLASMA GENERATORS AND ASSOCIATED ANALYZERS USED IN THE MANUFACTURE OF INTEGRATED CIRCUITS, ELECTRONIC AND OPTICAL EQUIPMENT;PLASMA LABORATORY;
 

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Technical Examples
  1. An apparatus and method are described for etching Ni-containing films using gas phase plasma etching. Etching of Ti-Ni alloys is carried out by exposure to plasma comprising hydrogen halide (HX) and carbonyl etching gases. The Ti in the Ti-Ni alloy is etched via an ion-assisted reaction with HX and the Ni is etched by reacting with CO. The method is particularly well suited for anisotropic etching of Ti-Ni metal gates for CMOS applications. Etching of Ni-Fe layers is carried out by exposure to plasma comprising a carbonyl etching gas.