PRECISION MEASURING MACHINES

Brand Owner (click to sort) Address Description
ACCRETECH TOKYO SEIMITSU CO., LTD. 2968-2, Ishikawa-machi Hachioji Tokyo 192-8515 Japan Precision measuring machines, namely wafer thickness measuring machine, non-contact flatness measuring machine, digital length measuring machine, laser interference length measuring sensor, optical fiber laser interferometer measuring machine, surface texture measuring machine, three-dimensional measuring machine, surface texture and contour measuring machine, contour measuring machine, roundness measuring machine, roundness and cylindrical/flat profile analysis machine, coordinate measuring machine; data processing machines for use in processing coordinate measuring data, machine control gauge, displacement sensor, electric micrometer, pneumatic micrometer; computer controlled discrete device tester; automatic die selector, namely computerized equipment for testing semiconductors and for selection of dies for semiconductor manufacture; Electric or magnetic measuring machines/instruments, namely electric current or voltage detectors, magnetic measuring apparatus namely magnetic sensors, capacity measures; Optical apparatus/instruments, namely microscopes; Electronic machines and instruments and their parts and fittings, namely ultrasonic depth sounders; Automatic distribution vending machines; Network system comprised of computer hardware and software for wafer probing machines; Wafer inspection units;Repair and maintenance service for manufacturing and measuring apparatus, namely-- Metal working machines and tools, namely grinding machines, metal cutting machines; Chemical machines/apparatus, namely semiconductor wafer drying machines, semiconductor wafer scrubbing and washing machine; Semiconductor manufacturing equipment, namely wire slicing machine, wafer slicing machine, slicing machines for non-silicon wafers, sliced wafer carbon demounting and cleaning machine, wafer edge grinding machine, wafer probing machine, wafer dicing machine, dicing machine, chemical mechanical planarizers, and chemical mechanical grinders and back grinders; and Precision measuring machines and instruments used for production of semiconductor, liquid crystal and electronic components, namely wafer thickness measuring instrument, non-contact flatness measuring instrument, machines control gage, automatic measuring machine, displacement sensor, electric micrometer, pneumatic micrometer, digital length measuring instrument, laser interference length measuring sensor, optical fiber laser interferometer measuring unit, surface texture measuring instrument, three-dimensional measuring instrument, surface texture and contour measuring instrument, contour measuring instrument, roundness measuring instrument, roundness and cylindrical/flat profile analysis unit, coordinate measuring machines; repair and maintenance of data processing machines for use in processing coordinate measuring data; Computer controlled discrete device tester; automatic die selector, namely computerized equipment for testing semiconductors and for selection of dies for semiconductor manufacture; Wafer inspection units; Electric or magnetic measuring machines/instruments, namely electric current or voltage detectors, magnetic measuring apparatus namely magnetic sensors, capacity measures; Optical apparatus/instruments, namely microscopes; Electronic machines/instruments and their parts/fittings, namely ultrasonic depth sounders; Automatic distribution vending machines;The stippling shown in the drawing is a feature of the mark.;
ACCRETECH Kabushiki Kaisha Tokyo Seimitsu 2968-2, Ishikawa-machi Hachioji-shi Tokyo Japan Precision measuring machines, namely, wafer thickness measuring machine, digital length measuring machine, surface texture measuring machine, surface texture and contour measuring machine, contour measuring machine, roundness measuring machine, roundness and cylindrical/flat profile analysis machine, machine control gauge, displacement sensor, electric micrometer, pneumatic micrometer [ ; Wafer inspection units ];Metal working machines and tools, namely grinding machines, metal cutting machines; Semiconductor manufacturing equipment, namely wafer probing machine, wafer dicing machine, chemical mechanical grinders and back grinders; and machine parts therefor;
ACCRETECH TOKYO SEIMITSU CO., LTD. 2968-2, Ishikawa-machi Hachioji Tokyo 192-8515 Japan Precision measuring machines, namely, non-contact flatness measuring machines, laser interference length measuring sensors, optical fiber laser interferometer measuring machines, three-dimensional measuring machines, coordinate measuring machines; Data processing machines for use in processing coordinate measuring data; Computer controlled discrete device testers; Automatic die selector, namely, computerized equipment for testing semiconductors and for selection of dies for semiconductor manufacture; Electric or magnetic measuring machines and instruments, namely, electric current or voltage detectors, magnetic measuring apparatus in the nature of magnetic sensors, capacity measures; Optical instruments, namely, microscopes; Electronic machines and instruments and their parts and fittings, namely, ultrasonic depth sounders;Chemical machines, namely, semiconductor wafer drying machines, semiconductor wafer scrubbing and washing machines; Semiconductor manufacturing equipment, namely, wire slicing machines, wafer slicing machines, slicing machines for non-silicon wafers, sliced wafer carbon demounting and cleaning machines, wafer edge grinding machines, dicing machines, and chemical mechanical planarizers and machine parts therefor; Automatic distribution vending machines;
TSK Kabushiki Kaisha Tokyo Seimitsu 2968-2, Ishikawa-machi Hachioji-shi Tokyo Japan Precision measuring machines, namely, wafer thickness measuring machine, non-contact flatness measuring machine, digital length measuring machine, laser interference length measuring sensor, optical fiber laser interferometer measuring machine, three-dimensional measuring machine, contour measuring machine, coordinate measuring machines; data processing for coordinate measuring machines, machine control gauge, displacement sensor, electric micrometer, pneumatic micrometer; computer controlled discrete device tester; automatic die selector, namely, computerized equipment for testing semiconductors and for selection of dies for semiconductor manufacture; electric or magnetic measuring instrument, namely, electric current or voltage detectors, magnetic measuring apparatus, namely, magnetic sensors, capacity measures; optical apparatus, namely, microscopes; electronic machines and instruments and their parts and fittings, namely, ultrasonic depth sounders; automatic distribution vending machines; network system comprised of computer hardware and software for wafer probing machines; wafer inspection units;Semiconductor manufacturing equipment, namely, semiconductor wafer scrubbing and washing machine, wire slicing machine, wafer slicing machines, slicing machines for non-silicon wafers, sliced wafer carbon emounting and cleaning machine, wafer probing machine, and chemical mechanical planarizers;
TSK Kabushiki Kaisha Tokyo Seimitsu 2968-2, Ishikawa-machi Hachioji-shi Tokyo Japan Precision measuring machines, namely, surface texture measuring machine, surface texture and contour measuring machine, roundness measuring machine, roundness and cylindrical/flat profile analysis machine;Metal working machines namely, grinding machines, metal cutting machines; semiconductor manufacturing equipment, namely, wafer edge grinding machine, wafer dicing machine, dicing machine, and chemical mechanical grinders and back grinders;
WIN-WIN RELATIONSHIPS CREATE THE WORLD'S NO. I PRODUCTS Kabushiki Kaisha Tokyo Seimitsu 2968-2, Ishikawa-machi Hachioji-shi Tokyo Japan Precision measuring machines, namely wafer thickness measuring machine, non-contact flatness measuring machine, digital length measuring machine, laser interference length measuring sensor, optical fiber laser interferometer measuring machine, surface texture measuring machine, three-dimensional measuring machine, surface texture and contour measuring machine, contour measuring machine, roundness measuring machine, roundness and cylindrical/flat profile analysis machine, coordinate measuring machine; data processing for coordinate measuring machines, machine control gauge, displacement sensor, electric micrometer, pneumatic micrometer; Computer controlled discrete device tester; automatic die selector, namely computerized equipment for testing semiconductors and for selection of dies for semiconductor manufacture; Electric or magnetic measuring machines/instruments, namely electric current or voltage detectors, magnetic measuring apparatus namely magnetic sensors, capacity measures; Optical apparatus/instruments, namely microscopes; Electronic machines and instruments, namely, ultrasonic depth sounders and their parts and fittings sold therewith; Automatic distribution vending machines; Network system comprised of computer hardware and software for wafer probing machines; Wafer probing machine; Wafer inspection units;Apparatus for use in manufacturing of semiconductor, liquid crystal and electronic components, namely, wafer inspection machine, chemical mechanical planarizer, chemical mechanical grinder, chemical mechanical polishing machine, back surface grinder, wire saw slicing machine, wafer slicing machine, slicing machines for non-silicon wafers, sliced wafer carbon demounting and cleaning machine, wafer edge grinding machine, wafer dicing machine, and dicing machine;Steel drop-boxes for business use for home deliver services, laundry services and photo processing services;WIN WIN RELATIONSHIPS CREATE THE WORLDS NUMBER 1 PRODUCTS;Lockers for business use, for home delivery services, laundry services, and photo processing services; and coin-operated lockers;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A self coordinated machine network is established by two or more machines in proximity with each other via a wired or wireless network infrastructure. The machines are configured to establish an ad hoc network between themselves for sharing information related to their common applications. New machines that come into proximity of the network infrastructure are configured to join an existing ad hoc network. Machines that power down or are removed from proximity of the network infrastructure are eliminated from the ad hoc network. Communications between the constituent machines of the ad hoc network allow the machines to self coordinate the network and redundantly store information pertaining to the common and disparate applications of the various machines that comprise the self coordinated machine network.