TOKYO SEIMITSU CO., LTD.

ACCRETECH

Precision measuring machines, namely wafer thickness measuring machine, non-contact flatness measuring machine, digital length measuring machine, laser interference length measuring sensor, optical fiber laser interferometer measuring machine, surface texture measuring machine, three-dimensional measuring machine, surface texture and contour measuring machine, contour measuring machine, roundness measuring machine, roundness and cylindrical/flat profile analysis machine, coordinate measuring machine; data processing machines for use in processing coordinate measuring data, machine control gauge, displacement sensor, electric micrometer, pneumatic micrometer; computer controlled discrete device tester; automatic die selector, namely computerized equipment for testing semiconductors and for selection of dies for semiconductor manufacture; Electric or magnetic measuring machines/instruments, namely electric current or voltage detectors, magnetic measuring apparatus namely magnetic sensors, capacity measures; Optical apparatus/instruments, namely microscopes; Electronic machines and instruments and their parts and fittings, namely ultrasonic depth sounders; Automatic distribution vending machines; Network system comprised of computer hardware and software for wafer probing machines; Wafer inspection units;Repair and maintenance service for manufacturing and measuring apparatus, namely-- Metal working machines and tools, namely grinding machines, metal cutting machines; Chemical machines/apparatus, namely semiconductor wafer drying machines, semiconductor wafer scrubbing and washing machine; Semiconductor manufacturing equipment, namely wire slicing machine, wafer slicing machine, slicing machines for non-silicon wafers, sliced wafer carbon demounting and cleaning machine, wafer edge grinding machine, wafer probing machine, wafer dicing machine, dicing machine, chemical mechanical planarizers, and chemical mechanical grinders and back grinders; and Precision measuring machines and instruments used for production of semiconductor, liquid crystal and electronic components, namely wafer thickness measuring instrument, non-contact flatness measuring instrument, machines control gage, automatic measuring machine, displacement sensor, electric micrometer, pneumatic micrometer, digital length measuring instrument, laser interference length measuring sensor, optical fiber laser interferometer measuring unit, surface texture measuring instrument, three-dimensional measuring instrument, surface texture and contour measuring instrument, contour measuring instrument, roundness measuring instrument, roundness and cylindrical/flat profile analysis unit, coordinate measuring machines; repair and maintenance of data processing machines for use in processing coordinate measuring data; Computer controlled discrete device tester; automatic die selector, namely computerized equipment for testing semiconductors and for selection of dies for semiconductor manufacture; Wafer inspection units; Electric or magnetic measuring machines/instruments, namely electric current or voltage detectors, magnetic measuring apparatus namely magnetic sensors, capacity measures; Optical apparatus/instruments, namely microscopes; Electronic machines/instruments and their parts/fittings, namely ultrasonic depth sounders; Automatic distribution vending machines;The stippling shown in the drawing is a feature of the mark.;

ACCRETECH

Machinery installation; Repair or maintenance of metalworking machines and tools; Repair or maintenance of semiconductor manufacturing machines and systems; Repair or maintenance of measuring and testing machines and instruments;

ACCRETECH

Precision measuring machines, namely, non-contact flatness measuring machines, laser interference length measuring sensors, optical fiber laser interferometer measuring machines, three-dimensional measuring machines, coordinate measuring machines; Data processing machines for use in processing coordinate measuring data; Computer controlled discrete device testers; Automatic die selector, namely, computerized equipment for testing semiconductors and for selection of dies for semiconductor manufacture; Electric or magnetic measuring machines and instruments, namely, electric current or voltage detectors, magnetic measuring apparatus in the nature of magnetic sensors, capacity measures; Optical instruments, namely, microscopes; Electronic machines and instruments and their parts and fittings, namely, ultrasonic depth sounders;Chemical machines, namely, semiconductor wafer drying machines, semiconductor wafer scrubbing and washing machines; Semiconductor manufacturing equipment, namely, wire slicing machines, wafer slicing machines, slicing machines for non-silicon wafers, sliced wafer carbon demounting and cleaning machines, wafer edge grinding machines, dicing machines, and chemical mechanical planarizers and machine parts therefor; Automatic distribution vending machines;

ACCTEE

Precision measuring machines and instruments for industrial uses in the nature of measuring surface texture, contours, roundness and cylindrical measuring, and 3D coordinate measuring; precision measuring machines and instruments for industrial uses in the nature of measuring surface texture, contours, roundness and cylindrical measuring, and 3D coordinate measuring used in conjunction with corresponding computer network software; computer software for use in conjunction with precision measuring machines and instruments for industrial uses used to measure surface texture, contours, roundness and cylindrical measuring, and 3D coordinate measuring; computer software for use in conjunction with precision measuring machines and instruments for industrial uses used to measure surface texture, contours, roundness and cylindrical measuring, and 3D coordinate measuring; computer software for use in conjunction with precision measuring machines and software for use in conjunction with precision measuring machines and instruments for industrial uses corresponding to computer networks;79062882;

ACCTEE

Precision measuring machines and instruments for industrial uses; measuring of surface texture, contour measuring, roundness and cylindrical measuring, and 3D coordinate measuring; precision measuring machines and instruments for industrial uses corresponding to network; computer software for precision measuring machines and instruments for industrial uses; measuring of surface texture, contour measuring, roundness and cylindrical measuring, and 3D coordinate measuring; computer software for precision measuring machines and instruments for industrial uses corresponding to network;76702576;

ACCTEE

Precision measuring machines and instruments for industrial uses in the nature of measuring surface texture, contours, roundness and cylindrical measuring, and 3D coordinate measuring; precision measuring machines and instruments for industrial uses in the nature of measuring surface texture, contours, roundness and cylindrical measuring, and 3D coordinate measuring used in conjunction with corresponding computer network software; computer software for industrial use for measuring surface texture, contours, roundness and cylindrical measuring, and for 3D coordinate measuring and used in conjunction with precision measuring machines and instruments; computer software for operating precision measuring machines and instruments for industrial uses corresponding to computer networks;

DIGICOM

DIGITAL ELECTRONIC GAUGES FOR USE IN THE MACHINE TOOL INDUSTRY FOR MEASURING THE OUTER DIAMETER, INNER DIAMETER, THICKNESS, LENGTH OR OTHER DIMENSIONAL CHARACTERIATICS OF A WORKPIECE;

HANDYSURF

SURFACE ROUGHNESS MEASURING INSTRUMENT;HANDY SURF;

MAHOHDICING

cutting machines for manufacturing semiconductor chips; cutting machines for manufacturing liquid crystal displays; cutting machines for manufacturing electronic devices; precision cutting machines;

MAHOHDICING

dicing machines;

MINICOMMATE

ELECTRONIC GAUGES;

OPT-MEASURE

Interferometers;

PEAKTOP

ELECTRONIC GAUGES;PP;

PULCOM

AUTOMATIC ELECTRONIC MEASURING AND CONTROL DEVICES FOR MEASURING THE WORK PRODUCT OF CYLINDRICAL AND CENTERLESS GRINDING MACHINES AND AUTOMATIC PROFILING LATHES AND AUTOMATICALLY CONTROLLING THE SAME;

RONDCOM

ELECTRONIC INSTRUMENTS COMPRISING A GAUGE HEAD, INSTRUMENT BASE, AMPLIFYING, CONTROL AND RECORDING ELEMENTS FOR USE IN MEASURING THE ROUNDNESS, CONCENTRICITY AND CYLINDRICITY OF A WORKPIECE AND FOR RECORDING AND INDICATING THE SAME;

SURFCOM

[ ELECTRIC MICROMETERS, ] ELECTRO-MECHANICAL INSTRUMENTS FOR THE MEASUREMENT OF SURFACE ROUGHNESS [ , TRACING DRIVERS AND OTHER COMPONENTS THEREOF AND ACCESSORIES THEREFOR ];

TIMSYS

Computer software; electronic machines, apparatus and their parts; measuring machine/instruments;T I M S Y S;

TSK

[ PRECISION ELECTRONIC MEASURING DEVICES-NAMELY, ] ELECTRONIC GAUGES, GAUGES HEADS AND COMPARATOR STANDS THEREFOR, ELECTRONIC INSTRUMENTS TO MEASURE SURFACE ROUGHNESS, RECORDERS FOR USE WITH ELECTRONIC GAUGES AND MEASURING INSTRUMENTS, ELECTRONIC MEASURING AND CONTROL DEVICES FOR CONTROLLING MACHINE TOOLS; AIR GAUGES, AUTOMATIC ELECTRONIC TESTING, INSPECTING [ , SORTING AND ASSEMBLING DEVICES AND ] MACHINES FOR [ TESTING, INSPECTING, SORTING AND ASSEMBLING TRANSISTORS, GERMANIUM AND SILICON PELLETS, ] SILICON WAFERS, INTEGRATED CIRCUITS AND THE LIKE; [ DIGITAL MEASURING EQUIPMENT-NAMELY, ] CAM PROFILE DIGITAL MEASURING EQUIPMENT [ , FUNNEL MEASURING EQUIPMENT FOR COLOR BRAUN TUBE AND ROCKET POSTURE CONTROL EQUIPMENT ];

TSK

MACHINES FOR THE MANUFACTURE OF SILICON, PLANER AND EPITAXIAL TRANSISTORS-NAMELY, SLICING MACHINES [ , SCRIBING MACHINES AND BONDING MACHINES ];