PROCESSING SEMICONDUCTOR WAFERS

Brand Owner (click to sort) Address Description
ELEMENT 3-5 AIXaTECH GmbH Thomas-Edison-Str. 5-7 52499 Baesweiler Germany Processing of semiconductor wafers; coating of semiconductor wafers; custom manufacture of coated and uncoated semiconductor wafers; custom manufacture of semiconductor components, devices and circuits; application, custom manufacture for others and deposition of coatings; custom manufacture of electronic, optoelectronic and microelectronic components;Semiconductors; coated and uncoated semiconductor wafers; semi-conductor products; semiconductor elements; electronic, optoelectronic and microelectronic components; semi- finished products for the production of electronic, optoelectronic and microelectronic components; parts and accessories for all aforementioned goods, included in this class;Machines and machine tools for treatment of materials and for manufacturing; coating machines; coating machines for coating of electronic, optoelectronic and microelectronic components; coating machines for coating of semiconductor wafers; machines for the production of semiconductors; machines for the production of semiconductor wafers; semiconductor wafer processing equipment; machines for processing of semiconductor elements and semiconductor products; machines for the production of layer structures; machines for the deposition of layers; parts and accessories for all aforementioned goods, included in this class;ELEMENT THREE FIVE;Scientific and technological services; scientific and technological services relating to semiconductors, semiconductor elements, semiconductor wafers, semiconductor products and coatings thereof; engineering services relating to semiconductors, semiconductor elements, semiconductor wafers, semiconductor products and coatings thereof; engineering design and consultancy;
GLUFREE DISCO CORPORATION 13-11, Omori-Kita 2-chome, Ota-ku Tokyo 143-8580 Japan Processing of semiconductor wafers; rental of semiconductor wafer manufacturing machines and systems;Metalworking machines, namely, cutting machines, grinding machines, polishing machines; metalworking machine tools; glassware manufacturing machines, namely, glass-working machines and glaziers' diamond; semiconductor manufacturing machines and systems composed of semiconductor wafer dicing machines, semiconductor wafer grinding machines, deionized water recycling units and semiconductor cleaning units; apparatus in the nature of a machine for surface protection processing of semiconductor wafers; apparatus in the nature of a machine for surface protection processing of electronic components;GLUE FREE;
IMASENIC IMASENIC Advanced Imaging S.L. Pl. Tetuan 40-41 E-08010 Barcelona Spain Processing of semiconductor wafers; custom manufacture of semiconductor components, devices and circuits;Circuit boards provided with integrated circuits; chips, namely, integrated circuits; analogue electric or electronic circuits; electric or electronic circuits; electronic chips for imaging sensors; electronic circuit board; electronic circuit board; electronic circuits; electronic circuit boards; electronic integrated circuits; hybrid analog and digital circuits; hybrid integrated circuits; integrated circuit; integrated circuit boards; integrated circuit chips; integrated circuit modules; integrated circuit module; integrated circuits; integrated electronic circuits; integrated electric circuits; large scale integrated circuits; printed circuit boards; printed circuit boards incorporating integrated circuits; printed circuit expansion boards; printed electronic circuits; raster image processors; semiconductor chips; silicon chips; silicon chips with electronic components for imaging; system on chip; wafers for integrated circuits; active infra-red sensors; bio-sensors for measuring imaging, not for medical use; bio chip sensors for measuring imaging, not for medical use; image detectors; digital sensors for measuring light, electromagnetic radiation and charged particles and measuring images, not for medical use; digital sensory devices for measuring light, electromagnetic radiation and charged particles and measuring images, not for medical use; distance sensors in the nature of distance measuring apparatus; electro-optical sensors; electronic sensors for measuring imaging; electronic sensors for measuring solar radiation; electronic sensors for measuring solar radiation; infrared detectors; infrared sensors; instruments for detecting traffic, namely, vehicle recognition cameras; Internet of things (IoT) sensors for measuring light, electromagnetic radiation and charged particles; light sensors; LED position sensors; object detecting electronic sensors for imaging; optical sensors; particle detectors for imaging for radiation; photoelectric sensors; photo sensors for measuring light, electromagnetic radiation and charged particles; electronic sensors for imaging for measuring light, electromagnetic radiation and charged particles; sensors for measuring depth; sensors for privacy protection for imaging for measuring light, electromagnetic radiation and charged particles;The wording IMASENIC has no meaning in a foreign language.;Advisory services relating to industrial design; advisory services relating to design engineering; computer aided design services; computer-aided engineering design services; computer assisted engineering design services; consultancy services relating to design of electronic and electrical circuits; consumer product design; custom design services of electronic and electrical circuits; design and development of new technology for others; design and development of new products; design and testing for new product development; design and testing of new products; design of computer microchips for others; design of electric circuit boards for others; design of integrated circuits for others; design of instruments for others; design of manufacturing methods; design of measurement systems for others; design of mathematical models for others; design of mechanical, electromechanical and optoelectronic apparatus and instruments for others; design of optical and micro optical components for others; design of optical components for others; design services relating to integrated circuits for others; design services relating to the creation of masks for others; designing of data processing systems for others; designing of electrical systems for others; designing of electronic systems for others; designing of microchips for others; engineering and computer aided engineering services for others; engineering consultancy relating to design; engineering design and consultancy; hardware design for others; microchip design services for others; new product design for others; design of new products for others; packaging design for others; packaging design services for others; packaging designs for others; product design for others; product design and development for others; product design services for others; product development for others; product development consultation for others; product development for others; product research and development for others; scientific and technological design in the field of imaging; technological services and design relating thereto in the field of electronic and electrical circuits for imaging circuits; x-ray imaging, other than for medical purposes; visual testing of apparatus in the field of electrical engineering; testing of new products;
SENIC SENIC, Inc. 17-15 4sandan 7-ro Jiksan-eup, Seobuk-gu Cheonan-Si 31040 Republic of Korea processing of semiconductor wafers for others; processing of semiconductor elements for others;The mark consists of the word Senic with a solid curved shape placed immediately above the letters enic, with the dot of the letter i being formed by a teardrop shaped cutout in the solid curved shape.;electrical and scientific apparatus, namely, semiconductor wafers; ingots being prepared substrates for the manufacture of semi-conductors; silicon carbide single-crystal wafers for semiconductors; silicon carbide wafers for semiconductors; semiconductor elements;Color is not claimed as a feature of the mark.;scientific and technological services, namely, analysis of semiconductor wafers for others; analysis of semiconductors for others;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A method and structure for fabricating semiconductor wafers. The method comprises providing a plurality of semiconductor wafers. The plurality of semiconductor wafers comprises a first semiconductor wafer and a second semiconductor wafer. The first semiconductor wafer is located adjacent to the second semiconductor wafer. A relationship is provided between a plurality of values for an electrical characteristic and a plurality of materials. A material is chosen from the plurality of materials existing in the relationship. A substructure is formed comprising the material sandwiched between a topside of the first semiconductor wafer and a backside of a portion of the of the second semiconductor wafer. The plurality of semiconductor wafers are placed into a furnace comprising an elevated temperature for processing resulting in a value for the first semiconductor wafer of the electrical characteristic that corresponds to said material in said relationship.