SEMICONDUCTOR MANUFACTURING MACHINES SYSTEMS

Brand Owner (click to sort) Address Description
CELLESTA TOKYO ELECTRON LIMITED 3-1 Akasaka 5-chome Minato-ku, Tokyo 107-6325 Japan Semiconductor manufacturing machines/systems; their parts and fittings, liquid crystal substrate manufacturing apparatus, their parts and fittings;
CELLESTA TOKYO ELECTRON LIMITED 3-1 Akasaka 5-chome Minato-ku, Tokyo 107-6325 Japan Semiconductor manufacturing machines and systems, flat panel display manufacturing machines and apparatus;
EXPEDIUS TOKYO ELECTRON LIMITED 3-1 Akasaka 5-chome Minato-ku, Tokyo 107-6325 Japan Semiconductor manufacturing machines and systems, flat panel display manufacturing machines and apparatus;
QUIXACE KOKUSAI ELECTRIC CORPORATION 3-4, Kandakaji-cho, Chiyoda-ku Tokyo 101-0045 Japan Semiconductor manufacturing machines and systems; semiconductor element manufacturing machines; integrated circuit manufacturing machines; CVD (Chemical vapor deposition) machines used for semiconductor manufacturing; diffusion machines used for semiconductor manufacturing; oxidation machines used for semiconductor manufacturing; etching machines used for semiconductor manufacturing; epitaxial reaction machines used for semiconductor manufacturing; epitaxial growth machines used for semiconductor manufacturing; ion implantation machines used for semiconductor manufacturing; semiconductor wafer processing machines; washing machines used for semiconductor manufacturing; annealing machines used for semiconductor manufacturing; heat treatment machines used for semiconductor manufacturing and parts for all the foregoing;QUICK ACE;
RAD Lintec Kabushiki Kaisha 23-23, Honcho, Itabashi-ku Tokyo 173-0001 Japan Semiconductor manufacturing machines and systems, namely, semiconductor manufacturing machines, semiconductor substrates manufacturing machines, and semiconductor wafer processing machines, machines for applying labels, machines for printing labels, machines for UV irradiation to adhesive materials on semiconductor materials, machines for applying adhesive materials to semiconductor materials and machines for releasing adhesive materials from semiconductor materials;
ROOFWAY DISCO CORPORATION 13-11, Omori-Kita 2-chome, Ota-ku Tokyo 143-8580 Japan Semiconductor manufacturing machines and systems comprised of semiconductor wafer dicing machines, semiconductor wafer grinding machines, deionized water recycling units and semiconductor cleaning units; metalworking machines, namely cutting machines and grinding machines; metal working machine tools; loading-unloading machines and apparatus;ROOF WAY;
SHINKAWA SHINKAWA LTD. Musashimurayama-shi 51-1, Inadaira 2-chome Tokyo 208-8585 Japan Semiconductor manufacturing machines and systems comprised of die-bonders, wire bonders, chip on film bonders, flip chip bonders, bump bonders, discreet assemblers, package sorters, tape bonders and die transferring machines;The mark itself is solid blue.;Repair or maintenance of integrated circuit manufacturing machines and systems; repair or maintenance of semiconductor manufacturing machines and systems;The color(s) blue is/are claimed as a feature of the mark.;
SMART SUPPLY FEEDER JUKI KABUSHIKI KAISHA (JUKI CORPORATION) 2-11-1, Tsurumaki, Tama-shi Tokyo 206-8551 Japan Semiconductor manufacturing machines and systems; mounting machine for electronic parts on a circuit board; mounting machine for semiconductor production equipment; electronic component mounting machine feeders; component feeders for electronic components mounting machines; industrial robots; industrial robotic arms and parts and accessories therefor; robotic mechanisms and their parts for conveying goods; conveying machines; appliance for surface mounting as a part of servomotors; automatic handling machines in the form of automated storage units for storing and providing components used in surface mounting; automatic handling machines in the form of automated storage cabinets for storing and providing components used in surface mounting; automated cabinets for electric components used in surface mounting, as parts of machines; loading-unloading machines and apparatus; robotic mechanisms being parts of loading-unloading machines and apparatus; transporters [machines]; power operated handling, conveying and lifting machines in the form of storage unit for parts used in surface mounting system; power operated handling, conveying and lifting machines in the form of storage unit for surface mounting parts used in semiconductor manufacturing machines and systems; automatic warehousing systems; automatic conveying machines; servomotors;
TAIKO DISCO CORPORATION 13-11, Omori-Kita 2-chome, Ota-ku Tokyo 143-8580 Japan Semiconductor manufacturing machines and systems comprised of semiconductor wafer dicing machines, semiconductor wafer grinding machines, deionized water recycling units and semiconductor cleaning units;
ยต-CELL TOKYO ELECTRON LIMITED 3-1 Akasaka 5-chome Minato-ku, Tokyo 107-6325 Japan Semiconductor manufacturing machines/systems; their parts and fittings, liquid crystal substrate manufacturing apparatus, their parts and fittings;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. Systems and methods for guiding one or more web components in connection with a web converting manufacturing process such as that used for manufacturing disposable absorbent garments. Some of the disclosed embodiments include relating inspection data, such as product (or process) attribute data, to data from other manufacturing-related systems. Also disclosed are systems and methods for linking product (or process) attribute data obtained during the manufacturing process with one or more data sources including raw material data, process setting data, product quality data, and/or productivity data. Also disclosed are systems and methods for identifying manufacturing set point changes and automatically implementing such changes and automated web steering changes based on data from one or more inspection systems.