SEMICONDUCTOR PACKAGING

Brand	Owner (click to sort)	Address	Description
MICROLEADFRAME	AMKOR TECHNOLOGY, INC.	2045 East Innovation Circle Tempe AZ 85284	Semiconductor packaging;MICRO LEAD FRAME;Color is not claimed as a feature of the mark.;
TAPEARRAY	AMKOR TECHNOLOGY, INC.	2045 East Innovation Circle Tempe AZ 85284	SEMICONDUCTOR PACKAGING, NAMELY, A POLYMIDE BASED SUBSTRATE BALL GRID ARRAY PACKAGE;TAPE ARRAY;
	Where the owner name is not linked, that owner no longer owns the brand

Technical Examples

A packaging component used for constituting a package mounting a semiconductor element, and a semiconductor package using the packaging component. The packaging component has on at least a portion of the surface thereof a covered surface which is sealed with an insulating resin or on which an adhesive layer is applied, and the packaging component comprises a conductor substrate and an electrically conducting layer partly or entirely covering the surface thereof, and the electrically conducting layer comprises a rough-surface plated layer having a roughened surface profile on the covered surface. The packaging component includes, for example, a lead frame and a heat-radiating or heat-dissipating plate.