AMKOR TECHNOLOGY, INC.

AMKARD

Manufacture of multi-media cards to the order and/or specification of others;AMKOR CARD;Design of multi-media cards to the order and/or specification of others;

AMKOR

Import and Export Agency Services in the Field of Electronic Components and Systems;

AMKOR

Custom fabrication of semiconductors and semiconductor packages, namely, the assembly of semiconductor devices for others;The mark consists of the term AMKOR, with the A being stylized.;Semiconductor packages, namely, semiconductor packages comprised of semiconductor dies and interconnects;Color is not claimed as a feature of the mark.;

AMKOR

Custom fabrication of semiconductors and semiconductor packages, namely, the assembly of semiconductor devices for others;Semiconductor packages, namely, semiconductor packages comprised of semiconductor dies and interconnects;Design and testing of semiconductor devices for others;

AMKOR TECHNOLOGY

CUSTOM FABRICATION; PACKAGING, NAMELY, ENCAPSULATION; AND ASSEMBLY OF SEMICONDUCTOR DEVICES FOR OTHERS;SEMICONDUCTOR PACKAGES;TECHNOLOGY;DESIGN OF PACKAGING FOR SEMICONDUCTOR DEVICES FOR OTHERS, AND TESTING OF SEMICONDUCTOR DEVICES;

AMKOR TECHNOLOGY

CUSTOM FABRICATION, PACKAGING, NAMELY, ENCAPSULATION AND ASSEMBLY OF SEMICONDUCTOR DEVICES FOR OTHERS;SEMICONDUCTOR PACKAGES;In the statement, column 1, line 1 is deleted and Amkor Technology, Inc., (Delaware Corporation), is inserted.;TECHNOLOGY;DESIGN OF PACKAGING FOR SEMICONDUCTOR DEVICES FOR OTHERS, AND TESTING OF SEMICONDUCTOR DEVICES;

CHIPARRAY

CERAMIC SUBSTRATE OR EPOXY LAMINATE SUBSTRATE WITH COPPER CIRCUIT TRACES IN ENCAPSULATED PLASTIC FOR PACKAGING INTEGRATED CIRCUITS AND TO CONNECT INTEGRATED CIRCUITS TO PRINTED CIRCUIT BOARDS;CHIP ARRAY;

CIMITAR

Industrial process control and testing software;

EPAD

PLASTIC INTEGRATED CIRCUIT PACKAGING WHICH INCORPORATES A DIE ATTACH PADDLE WHICH IS DEPRESSED SUCH THAT IT IS FLUSH WITH THE PACKAGE BOTTOM SURFACE FOR THERMAL AND ELECTRICAL ENHANCEMENT;ELECTRICAL PADDLE;

ETCSP

Semiconductor packaging for users and manufacturers of semiconductors and devices utilizing semiconductors;

EXPOSEDPAD

PLASTIC INTEGRATED CIRCUIT PACKAGING WHICH INCORPORATES A DIE ATTACH PADDLE WHICH IS DEPRESSED SUCH THAT IT IS FLUSH WITH THE PACKAGE BOTTOM SURFACE FOR THERMAL AND ELECTRICAL ENHANCEMENT;EXPOSED PAD;

FLEXCSP

Custom fabrication of semiconductors and semiconductor packages, namely, the assembly of semiconductor devices for others;Semiconductor packages, namely, semiconductor packages comprised of semiconductor dies and interconnects;Design and testing of semiconductor devices for others;

FLEXCSP

Custom fabrication, packaging and assembly of semiconductor devices for others;Semiconductor packages;FLEX CSP;Design and testing of semiconductor devices for others;

FLIPSTACK

Semiconductor packages, namely, semiconductor packages comprised of semiconductor dies and interconnects;FLIP STACK;

FUSIONQUAD

Semiconductor packages, namely, semiconductor packages comprised of semiconductor dies and interconnects;FUSION QUAD;

INTEGRATED PACKAGE ON PACKAGE

Custom fabrication, namely, the assembly and encapsulation of semiconductor devices for others;Semiconductor package modules comprised of semiconductor dies and signal routing structures;Design of packaging for semiconductor devices for others, and testing of semiconductor devices;

IPOP

Custom fabrication, namely, the assembly and encapsulation of semiconductor devices for others;The mark consists of a stylized lowercase letter i followed by the uppercase letter P, the lowercase letter o, and the uppercase letter P.;I POP;Color is not claimed as a feature of the mark.;testing of semiconductor devices;

MICROLEADFRAME

Semiconductor packaging;MICRO LEAD FRAME;Color is not claimed as a feature of the mark.;

MLF

SEMICONDUCTOR PACKAGING FOR USERS AND MANUFACTURERS OF SEMICONDUCTORS AND DEVICES UTILIZING SEMICONDUCTORS;

MLFLEX

Semiconductor packaging for users and manufacturers of semiconductors and devices utilizing semiconductors;

POSSUM

Custom fabrication of semiconductors and semiconductor packages, namely, the assembly of semiconductor devices for others;Semiconductor packages, namely, semiconductor packages comprised of semiconductor dies and interconnects;

POWERCSP

Custom fabrication of semiconductors and semiconductor packages, namely, the assembly of semiconductor devices for others;Semiconductor packages, namely, semiconductor packages comprised of semiconductor dies and interconnects;Design and testing of semiconductor devices for others;

POWERQUAD

electronic components and custom designed electronic components; namely, electronic and integrated circuit boards and semiconductors;POWER QUAD;

POWERSOP

SEMICONDUCTOR PACKAGING INCORPORATING HEAT DISSIPATION STRUCTURES;POWER SOP;

SHIELDPAK

Semiconductor packaging for users and manufacturers of semiconductors and devices utilizing semiconductors;

SILICON-PACKAGE ARCHITECTURE

DESIGN CONSULTING SERVICES, EDA TOOLS, CAD TOOLS INTEGRATED CIRCUIT DESIGN ELEMENTS, PACKAGE DESIGN AND OTHER PRODUCTS AND SERVICES ASSOCIATED WITH SEMICONDUCTOR WAFER FABRICATION, PACKAGE, ASSEMBLY AND TEST;

SNAPARRAY

Semiconductor packaging for users and manufacturers of semiconductors and devices utilizing semiconductors;

SUPERBGA

electronic circuitry modules interconnecting a multiplicity of integrated circuit chips as a unit;SUPER BGA;

SWIFT

Custom fabrication of semiconductors and semiconductor packages, namely, the assembly of semiconductor devices for others;Semiconductor packages, namely, semiconductor packages comprised of semiconductor dies and interconnects;

TAPEARRAY

SEMICONDUCTOR PACKAGING, NAMELY, A POLYMIDE BASED SUBSTRATE BALL GRID ARRAY PACKAGE;TAPE ARRAY;

TMV

Semiconductor devices, namely, semiconductor packages comprised of semiconductor dies and interconnects;

VISIONPAK

INTEGRATED CIRCUITS USED WITH TOYS AND CAMERAS, INCLUDING SECURITY CAMERAS AND VIDEO CAMCORDERS;VISION PACK;

WSCSP

SEMICONDUCTOR PACKAGES;