SEMICONDUCTOR PACKAGES

Brand Owner (click to sort) Address Description
FLIPSTACK AMKOR TECHNOLOGY, INC. 2045 East Innovation Circle Tempe AZ 85284 Semiconductor packages, namely, semiconductor packages comprised of semiconductor dies and interconnects;FLIP STACK;
FUSIONQUAD AMKOR TECHNOLOGY, INC. 2045 East Innovation Circle Tempe AZ 85284 Semiconductor packages, namely, semiconductor packages comprised of semiconductor dies and interconnects;FUSION QUAD;
MICROGRID ARRAY ChipScale Inc. 576 Charcot Avenue San Jose CA 95131 semiconductor packages;MICRO GRID ARRAY;ARRAY;
MIRRORFLASH FUJITSU LIMITED 1-1, Kamikodanaka 4-chome, Nakahara-ku Kawasaki-shi, Kanagawa 211-8588 Japan SEMICONDUCTOR PACKAGES, LARGE SCALE INTEGRATED (LSI) CHIPS, INTEGRATED CIRCUITS (ICs), IC MEMORY CARDS, MEMORY CHIPS and MICROPROCESSOR CHIPS;MIRROR FLASH;
UGA ChipScale Inc. 576 Charcot Avenue San Jose CA 95131 semiconductor packages;MGA;
ULTRA UBGA Substrate Technologies, Inc. 2410 Luna Road Carrollton TX 75006 semiconductor packages, namely, substrates for lead-on-chip semiconductor packages;
VIATHIN SHELDAHL, INC. 1150 Sheldahl Road Northfield MN 550570170 semiconductor packages; microcircuits; printed circuit boards and components therefor;
VSPA Panda Project, Inc., The 6421 Congress Avenue Suite 114 Boca Raton FL 33487 semiconductor packages;
WSCSP AMKOR TECHNOLOGY, INC. 2045 East Innovation Circle Tempe AZ 85284 SEMICONDUCTOR PACKAGES;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. Disclosed are a wafer level stacked package and its manufacturing method. As one example, in such a wafer level stacked package, a first semiconductor die is electrically connected to an upper surface of a substrate and a second semiconductor die is electrically connected to a lower surface of the substrate. That is, with respect to one substrate, semiconductor dies can be stacked on upper and lower surfaces of the substrate. Also, underfill is formed between the respective semiconductor dies and the substrate, thereby enhancing bonding forces between the respective semiconductor dies and the substrate. In addition to stacking the semiconductor dies, packages can be stacked with each other. That is, it is possible to stack a plurality of completed wafer level packages with each other in an up-and-down direction.