SEMICONDUCTOR PACKAGING USERS

Brand Owner (click to sort) Address Description
ETCSP AMKOR TECHNOLOGY, INC. 2045 East Innovation Circle Tempe AZ 85284 Semiconductor packaging for users and manufacturers of semiconductors and devices utilizing semiconductors;
MLF AMKOR TECHNOLOGY, INC. 2045 East Innovation Circle Tempe AZ 85284 SEMICONDUCTOR PACKAGING FOR USERS AND MANUFACTURERS OF SEMICONDUCTORS AND DEVICES UTILIZING SEMICONDUCTORS;
MLFLEX AMKOR TECHNOLOGY, INC. 2045 East Innovation Circle Tempe AZ 85284 Semiconductor packaging for users and manufacturers of semiconductors and devices utilizing semiconductors;
SHIELDPAK AMKOR TECHNOLOGY, INC. 2045 East Innovation Circle Tempe AZ 85284 Semiconductor packaging for users and manufacturers of semiconductors and devices utilizing semiconductors;
SNAPARRAY AMKOR TECHNOLOGY, INC. 2045 East Innovation Circle Tempe AZ 85284 Semiconductor packaging for users and manufacturers of semiconductors and devices utilizing semiconductors;
 

Where the owner name is not linked, that owner no longer owns the brand

    
Technical Examples
  1. A packaging component used for constituting a package mounting a semiconductor element, and a semiconductor package using the packaging component. The packaging component has on at least a portion of the surface thereof a covered surface which is sealed with an insulating resin or on which an adhesive layer is applied, and the packaging component comprises a conductor substrate and an electrically conducting layer partly or entirely covering the surface thereof, and the electrically conducting layer comprises a rough-surface plated layer having a roughened surface profile on the covered surface. The packaging component includes, for example, a lead frame and a heat-radiating or heat-dissipating plate.