MACDERMID ENTHONE INC.

ACTANE

ETCHING ACCELERATORS TO SPEED THE DISSOLVING OF METALS;

ALPHAPREP

ALPHA PREP;Chemical product, namely, a chemical solution for the surface treatment of printed circuit boards and metal finishing;

ALPHASTAR

ALPHA STAR;Silver process chemistry, namely silver plating compositions used in the manufacture of printed circuit boards;

ANKOR

ANCHOR;Color is not claimed as a feature of the mark.;Chromium plating compositions for electroplating, namely, chemical products, salts, brighteners and additives for galvanic baths;

AUTRONEX

Electrolyte for Use in Gold Plating Process;

BLACK PEARL

Chemicals for Use in Metal Finishing Processes - Specifically Processes for Electroplating or Electrodeposition of Metals Such as Nickel on a Substrate;

BRONZEX

BRONZE;CHEMICAL COMPOSITIONS FOR USE IN THE DEPOSITION OF ALLOYS CONSISTING OF COPPER AND TIN;

CLEARLYTE

chemicals and chemical compositions for use in forming coatings on substrates by electrodeposition and for treating substrates before and/or after coating;

CSN

[ Insulating paints, varnishes and lacquers for use in shielding against electromagnetic induction; plastic goods containing electrically conductive polymers, namely, films for commercial and industrial packing uses, and for use in the further manufacture of housings, electrical components, optical switches, sensors and membranes for gas separation and insulating uses ];[ Varnishes, lacquers in the nature of a coating, rust preservatives in the nature of a coating and coatings for use in preventing corrosion for industrial equipment and machinery; paints, varnishes, and lacquers containing electrically conductive polymers for electrochemical use ];Chemicals used in polymer fields of science and electrochemical industries for use in the manufacture of films, housings, electrical components, sensors, circuit boards, optical switches and membranes for gas separation, and for corrosion protection in electrochemical devices; unprocessed artificial resins and unprocessed plastics containing electrically conductive polymers for use in polymer fields of science and electrochemical industries;

CUPROSTAR

CUPRONICKEL STAR;Color is not claimed as a feature of the mark.;Metal plating chemical compositions, namely, electrolytic acid copper solution;

DECOGUARD

plating and surface finishing services, namely, plating articles with copper, nickel and chrome;DECO GUARD;engineering services in the field of industrial chemical use in metal and plastic finishing, plating, etching and surface finishing industries; scientific services, namely, scientific research, analysis and testing, regarding the use of industrial chemicals in metal and plastic finishing, plating, etching and surface finishing;

DIMENSION

chemicals used in metal plating processes, particularly, chemicals for use in zinc plating processes;

DUR-NI

CHEMICAL PLATING SOLUTIONS AND ADDITION AGENTS FOR USE IN THE ELECTRODEPOSITION OF METALS;

EBONOL

Chemical Compound for Oxidizing Metal Articles;

ELPELYT

Chemicals for use in electroless nickel plating processes;

ENBOND

PRODUCTS FOR CLEANING AND ACTIVATING METAL;

ENDURE

Chemical compositions for producing corrosion inhibiting finish on metals and for preparing metal surfaces for the application of a finished surface, namely, corrosion inhibitors, etching mordents, metal plating chemical compositions, in the nature of conditioners, activators, neutralizers, and microetches for use in the automotive, aerospace defense, building hardware, energy including oil and gas, electronics, and industrial finishes industries;

ENFILL

Chemicals for use in the manufacture of circuit boards; metal plating chemical compositions, namely, electrolytic copper solutions;

ENFINITY

INFINITY;Chemical compositions for use in metal deposition processes and addition agents therefor, namely, chemicals for use in electroless nickel plating processes;

ENGAGE

Downloadable software used by customers to manage and analyze chemistry at customer sites;

ENLUBE

chemicals for use in electroless nickel plating processes;

ENMAG

ENTHONE MAGNESIUM;Chemicals used in plating magnesium;

ENPLATE

Chemical Compositions for Use in Metal Deposition Processes and as Addition Agents Therefor;

ENPREP

chemicals and chemical preparations for surface conditioning of metal substrates;

ENPURE

Color is not claimed as a feature of the mark.;[ chemical compositions for use in metal deposition processes and addition agents therefor, namely, chemicals and synthetic resins for use in nickel plating and purification ];purification equipment for purifying electrolytic nickel during an electroplating process;

ENSEAL

chemicals for use in plating processes, namely, chemical compositions used to form protective coatings on metal surfaces;

ENSTRIP

REAGENTS TO DISSOLVE OR AID IN THE DISSOL VING OF METALS FOR USE IN THE CLEANING OR STRIPPING OF METALS;

ENTEK

Chemical compositions for cleaning and protecting metal surfaces in the field of printed circuit board fabrication;

ENTHOBRITE

COMPOSITIONS TO BRIGHTEN AND PREVENT TARNISHING OF METAL SURFACES;

ENTHONE

Research Services for Others Related to the Processing of Metals and Metal Products;

ENTRACE

Inks used in the manufacture of electronic devices, namely, inductive phone cards, radio frequency identification (RFID) devices and flexible circuit devices;

ENVISION

chemical for use in the manufacture of printed circuitboards;

EVABRITE

EVERBRIGHT;Chemical Composition for Inhibiting the Tarnishing of Silver and Silver Electroplate Surfaces;

HELIOFAB

chemicals used for electroplating during the manufacture of solar cells and photovoltaic arrays;

LECTRO-NIC

ELECTROPLATING COMPOSITION AND SOLUTION;ELECTRO-NIC;

MICROFAB

MICOR FAB;chemicals for use in the plating processes;

NEUTRONEX

GOLD PLATING COMPOSITION AND COMPONENTS THEREOF;

OMEGA

chemicals for use in metal plating processes and fabrication of semiconductor wafers;

ORGANIC NANOMETAL

[ LACQUERS IN THE NATURE OF A COATING, CORROSION INHIBITORS IN THE NATURE OF A COATING];CHEMICALS FOR USE IN THE MANUFACTURE OF ELECTRICAL AND ELECTRONIC COMPONENTS; CHEMICAL PREPARATIONS ON THE BASIS OF CONDUCTIVE POLYMERS FOR USE IN ELECTRONICS AND ELECTROTECHNICS;

ORMECON

[ insulating paint, varnishes and lacquers for use in shielding against electromagnetic induction;] [ plastic goods containing electrically conductive polymers, namely, films for commercial and industrial packing uses, and for use in the further manufacture of housings, electrical components, optical switches, sensors and membranes for gas separation and insulating uses ];[ varnishes, lacquers in the nature of a coating, rust preservatives in the nature of a coating and coatings for use in preventing corrosion for industrial equipment and machinery, paints, varnishes, and lacquers containing electrically conductive polymers for electrochemical uses ];chemicals used in polymer fields of science and electrochemical industries for use in the manufacture of films, housings, electrical components, sensors, circuit boards, optical switches and membranes for gas separation, and for corrosion protection in electrochemical devices; unprocessed artificial resins and unprocessed plastics containing electrically conductive polymers for use in polymer fields of science and electrochemical industries;

PALLADEX

ELECTROPLATING COMPOSITION;

PEARLBRITE

PEARL BRIGHT;electrolytic plating chemistries that are plated over nickel that produces satin and matte finishes on steel, aluminum, copper, copper alloys, plastics and other substrates;

PERMA PASS

Chemicals for Forming Passivate Coatings on Metallic Surfaces, Particularly, Zinc;

PUR-A-GOLD

GOLD PLATING SOLUTIONS;PURE-GOLD;

RHODEX

ELECTROPLATING COMPOSITION AND SOLUTION;

SEL-REX

Salts and Other Reagents, Used in the Forming of Electrolytes in the Electrodeposition of Precious Metals-Namely, Gold Salts, Silver Salts, Platinum Salts, Palladium Salts, Rhodium Salts; Mixtures of Said Precious Metal Salts with Each Other and with Base Metal Salts; Copper Purifiers, Nickel Salts and Copper Salts;

SILVREX

ELECTROPLATING COMPOSITION AND SOLUTION;SILVEREX;

STANNOSTAR

CHEMICALS FOR USE IN THE ELECTRODEPOSITION OF METALS;

TECHXPERT

TECH EXPERT;chemistry consultation in the surface finishing and electronics industries;

TRICROLYTE

TRICROLIGHT;Chemicals for Use in Electroplating Processes, Particularly, Trivalent Chromium Electroplating Processes;

TRILYTE

TRY LIGHT;chrome electroplating chemistries in the nature of chemical preservatives for use as corrosion inhibitors used to coat metals, plastics and other substrates for decorative parts used in the automotive, hardware, plumbing, building applications and electronics industry;

UBAC

CHEMICAL PLATING SOLUTIONS, AND ADDITION AGENTS THEREFOR, FOR USE IN THE ELECTRODEPOSITION OF COPPER;U BACK;

UDIQUE

chemical additives for use with plating solutions in the treatment of plastics;

UDYLITE

MATERIALS FOR CADMIUM, NICKEL, CHROMIUM, COPPER, ZINC, BRASS, WHITE BRASS, SILVER, AND TIN ELECTROPLATING INCLUDING ELECTROLYTES, SALTS AND ADDITION AGENTS THEREFOR, TEST SET SOLUTIONS, AND CLEANING COMPOUNDS FOR ELECTROLYTIC, SOAK, SPRAY, AND GENERAL CLEANING OF METALS;YOUDELIGHT;

VELOCITY

chemicals for use in the plating processes for the electronic semiconductor, automotive and surface finish industries and not including the printing industry;

ZINCROLYTE

chemicals for use in the plating of zinc and zinc alloys;