Strasbaugh

	Strasbaugh contact information is shown below
Owner:	STRASBAUGH
Owner Address:	825 Buckley Road San Luis Obispo CA 93401
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Brands Owned byStrasbaugh

Brand:	NCOMPASS
Description:	Semiconductor wafer processing machines, namely, chemical mechanical planarizers, silicon wafer carriers, silicon wafer loaders, silicon wafer endpoint detectors, silicon wafer grinders, silicon wafer polishers and replacement parts therefor; photonics, optical and telecommunication component processing machines, namely, chemical mechanical planarizers,silicon wafer carriers, silicon wafer loaders, silicon wafer endpoint detectors, silicon wafer grinders, silicon wafer polishers and replacement parts therefor; all for the research, failure analysis, processing and production of semiconductor substrates, thin films, silicon discs, silicon wafers, optical components, photonics components and telecommunication components;ENCOMPASS;
Category:	SEMICONDUCTOR WAFER PROCESSING MACHINES

Brand:	NFINITY
Description:	Semiconductor wafer processing machines, namely, chemical mechanical planarizers, silicon wafer carriers, silicon wafer loaders, silicon wafer endpoint detectors, silicon wafer grinders, silicon wafer polishers and replacement parts therefor; photonics, optical and telecommunication component processing machines, namely chemical mechanical planarizers, silicon wafer carriers, silicon wafer loaders, silicon wafer endpoint detectors, silicon wafer grinders, silicon wafer polishers and replacement parts therefor; all for the research, failure analysis, processing and production of semiconductor substrates, thin films, silicon discs, silicon wafers, optical components, photonics components and telecommunication components;INFINITY;
Category:	SEMICONDUCTOR WAFER PROCESSING MACHINES

Brand:	NFOCUS
Description:	Grinding, polishing, and lapping machines for manufacturing semiconductors and photonics, optical and telecommunication components, and for semiconductor wafer-thinning; grinding, polishing, and lapping machines for the purpose of grinding, polishing, and lapping materials such as lenses, semiconductor wafers, fine metal, glass, plastic, or ceramic materials;INFOCUS;
Category:	GRINDING

Brand:	NGAUGE
Description:	Grinding, polishing, and lapping machines for manufacturing semiconductors and photonics, optical and telecommunication components, and for semiconductor wafer-thinning; grinding, polishing, and lapping machines for the purpose of grinding, polishing, and lapping materials such as lenses, semiconductor wafers, fine metal, glass, plastic, or ceramic materials;ENGAGE;
Category:	GRINDING

Brand:	NGENUITY
Description:	Semiconductor wafer processing machines, namely, chemical mechanical planarizers, silicon wafer carriers, silicon wafer loaders, silicon wafer endpoint detectors, silicon wafer grinders, silicon wafer polishers and replacement parts therefor; photonics, optical and telecommunication component processing machines, namely chemical mechanical planarizers, silicon wafer carriers, silicon wafer loaders, silicon wafer endpoint detectors, silicon wafer grinders, silicon wafer polishers and replacement parts therefor; all for the research, failure analysis, processing and production of semiconductor substrates, thin films, silicon discs, silicon wafers, optical components, photonics components and telecommunication components;INGENUITY;
Category:	SEMICONDUCTOR WAFER PROCESSING MACHINES

Brand:	NHANCE
Description:	Semiconductor wafer processing machines, namely, chemical mechanical planarizers, silicon wafer carriers, silicon wafer loaders, silicon wafer endpoint detectors, silicon wafer grinders, silicon wafer polishers and replacement parts therefor; photonics, optical and telecommunication component processing machines, namely chemical mechanical planarizers, silicon wafer carriers, silicon wafer loaders, silicon wafer endpoint detectors, silicon wafer grinders, silicon wafer polishers and replacement parts therefor; all for the research, failure analysis, processing and production of semiconductor substrates, thin films, silicon discs, silicon wafers, optical components, photonics components and telecommunication components;ENHANCE;
Category:	SEMICONDUCTOR WAFER PROCESSING MACHINES

Brand:	NLIGHTEN
Description:	Grinding, polishing, and lapping machines for manufacturing semiconductors and photonics, optical and telecommunication components, and for semiconductor wafer-thinning; grinding, polishing, and lapping machines for the purpose of grinding, polishing, and lapping materials such as lenses, semiconductor wafers, fine metal, glass, plastic, or ceramic materials;ENLIGHTEN;
Category:	GRINDING

Brand:	NOVATION
Description:	semiconductor wafer processing machines, namely, chemical mechanical planarizers, silicon wafer carriers, silicon wafer loaders, silicon wafer endpoint detectors, silicon wafer grinders, silicon wafer polishers and replacement parts therefor; photonics, optical and telecommunication component processing machines, namely chemical mechanical planarizers, silicon wafer carriers, silicon wafer loaders, silicon wafer endpoint detectors, silicon wafer grinders, silicon wafer polishers and replacement parts therefor; all for the research, failure analysis, processing and production of semiconductor substrates, thin films, silicon discs, silicon wafers, optical components, photonics components and telecommunication components;INNOVATION;
Category:	SEMICONDUCTOR WAFER PROCESSING MACHINES

Brand:	NPOINT
Description:	Seminconductor wafer processing equipment, namely, chemical mechanical planarizers, silicon wafer carriers, silicon wafer loaders, silicon wafer endpoint detectors, silicon wafer grinders, and silicon wafer polishers; photonics, optical and telecommunication component processing equipment, namely, chemical mechanical planarizers, silicon wafer carriers, silicon wafer loaders, silicon wafer endpoint detectors, silicon wafer grinders, and silicon wafer polishers, and replacement parts therefore; all for the research, failure analysis, processing and production of semiconductor substrates, thin films, silicon discs, silicon wafers, optical components, photonics components, and telecommunication components;N POINT; IN POINT;
Category:	SEMINCONDUCTOR WAFER PROCESSING EQUIPMENT

Brand:	NSPEC
Description:	Grinding, polishing, and lapping machines for manufacturing photonics, optical components and telecommunication components, grinding, polishing, and lapping machines for the purpose of grinding, polishing, and lapping materials such as lenses, fine metal, glass, plastic, or ceramic materials;INSPECT;
Category:	GRINDING

Brand:	NSPIRE
Description:	semiconductor wafer processing equipment, namely chemical mechanical planarizers, silicon wafer carriers, silicon wafer loaders, silicon wafer endpoint detectors, silicon wafer grinders, and silicon wafer polishers; photonics, optical and telecommunication component processing equipment, namely chemical mechanical planarizers, silicon wafer carriers, silicon wafer loaders, silicon wafer endpoint detectors, silicon wafer grinders, and silicon wafer polishers; all for the research, failure analysis, processing production of semiconductor substrates, thin films, silicon discs, silicon wafers, optical components, photonics components and telecommunication components;INSPIRE;
Category:	SEMICONDUCTOR WAFER PROCESSING EQUIPMENT

Brand:	NTEGRITY
Description:	Semiconductor wafer processing machines, namely chemical mechanical planarizers, silicon wafer carriers, silicon wafer loaders, silicon wafer endpoint detectors, silicon wafer grinders, silicon wafer polishers and replacement parts therefor; photonics, optical and telecommunication component processing machines, namely chemical mechanical planarizers, silicon wafer carriers, silicon wafer loaders, silicon wafer endpoint detectors, silicon wafer grinders, silicon wafer polishers and replacement parts therefor; all for the research, failure analysis, processing and production of semiconductor substrates, thin films, silicon discs, silicon wafers, optical components, photonics components and telecommunication components;INTEGRITY;
Category:	SEMICONDUCTOR WAFER PROCESSING MACHINES

Brand:	NTELLECT
Description:	Semiconductor wafer processing machines, namely, chemical mechanical planarizers, silicon wafer carriers, silicon wafer loaders, silicon wafer endpoint detectors, silicon wafer grinders, silicon wafer polishers and replacement parts therefor; photonics, optical and telecommunication component processing machines, namely chemical mechanical planarizers, silicon wafer carriers, silicon wafer loaders, silicon wafer endpoint detectors, silicon wafer grinders, silicon wafer polishers and replacement parts therefor; all for the research, failure analysis, processing and production of semiconductor substrates, thin films, silicon discs, silicon wafers, optical components, photonics components and telecommunication components;INTELLECT;
Category:	SEMICONDUCTOR WAFER PROCESSING MACHINES

Brand:	NTRIGUE
Description:	semiconductor wafer processing equipment, namely chemical mechanical planarizers, silicon wafer carriers, silicon wafer loaders, silicon wafer endpoint detectors, silicon wafer grinders, and silicon wafter polishers; photonics, optical and telecommunication component processing equipment, namely chemical mechanical planarizers, silicon wafer carriers, silicon wafer loaders, silicon wafer endpoint detectors, siliconwafer grinders, and silicon wafer polishers; operational software and components for chemical mechanical planarizers, silicon wafer carriers, silicon wafer loaders, silicon wafer endpoint detectors, silicon wafer grinders, and silicon wafer polishers; all for the research, failure analysis, processing and production of semiconductor substrates, thin films, silicon discs, silicon wafers, optical components, photonics components and telecommunication components;INTRIGUE;
Category:	SEMICONDUCTOR WAFER PROCESSING EQUIPMENT

Brand:	NTRIGUE
Description:	Semiconductor wafer processing equipment; photonics, optical and telecommunication component processing equipment; operational software; and components; namely - chemical mechanical planarizers, wafer carriers, wafer loaders, endpoint detectors, wafer grinders, and wafer polishers; all for the research, failure analysis, processing and production of semiconductor substrates, thin films, silicon discs, wafers, optical components, photonics components, and telecommunication components.;INTRIGUE;
Category:	SEMICONDUCTOR WAFER PROCESSING EQUIPMENT

Brand:	NTUITIVE
Description:	semiconductor wafer processing machines, namely, chemical mechanical planarizers, silicon wafer carriers, silicon wafer loaders, silicon wafer endpoint detectors, silicon wafer grinders, silicon wafer polishers and replacement parts therefor; photonics, optical and telecommunication component processing machines, namely chemical mechanical planarizers, silicon wafer carriers, silicon wafer loaders, silicon wafer endpoint detectors, silicon wafer grinders, silicon wafer polishers and replacement parts therefor; all for the research, failure analysis, processing and production of semiconductor substrates, thin films, silicon discs, silicon wafers, optical components, photonics components and telecommunication components;INTUITIVE;
Category:	SEMICONDUCTOR WAFER PROCESSING MACHINES

Brand:	NVISION
Description:	The mark consists of a stylized form of the word nVision.;Semiconductor wafer processing machines, namely, chemical mechanical planarizers, silicon wafer carriers, silicon wafer loaders, silicon wafer endpoint detectors, silicon wafer grinders, silicon wafer polishers and replacement parts therefor; photonics, optical and telecommunication component processing machines, namely chemical mechanical planarizers, silicon wafer carriers, silicon wafer loaders, silicon wafer endpoint detectors, silicon wafer grinders, silicon wafer polishers and replacement parts therefor; all for the research, failure analysis, processing and production of semiconductor substrates, thin films, silicon discs, silicon wafers, optical components, photonics components and telecommuncation components;N VISION;
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