TESSERA, INC.

BGA

semiconductor chip and chip carrier;IN THE STATEMENT, COLUMN 2, LINE 3, 5-19-1995 SHOULD BE DELETED, AND 5-22-1995 SHOULD BE INSERTED.;

BGA

thermoplastic and thermoset resins used for electronic computer chip packages; encapsulants and sealants made of silica and epoxy used as a protective coating for electronic components;

CHIP SCALE ELECTRONICS

PERIODICALS FOR THE COMPUTER INDUSTRY;

CHIP SCALE ELECTRONICS

PERIODICALS FOR THE COMPUTER INDUSTRY;

CHIP SCALE REVIEW

periodicals, namely, newsletters and magazines in the field of computers;CHIP SCALE REVIEW;CHIP and REVIEW;

CHIPSCALE INTERNATIONAL

educational services in the field of offering symposia to the computer industry;INTERNATIONAL;

COMPLIANT CHIP

semiconductor chip and chip carrier;CHIP;

COMPLIANT CHIP

Licensing of intellectual property;

EARLY HARVEST

business marketing consulting services;

EVERY PIECE TELLS A STORY

WHOLESALE SERVICES FEATURING HANDCRAFTED HOME ACCESSORIES AND SPECIALTY GOODS;

F-UBGA

SEMICONDUCTOR CHIP AND CHIP CARRIER;FUBGA;

FLEXIBAL

computer chip carriers; plastic stress-absorbing material used in computer chip packages;FLEXIBLE;

JUDGE US BY THE COMPANY WE KEEP

ENGINEERING SERVICES;

JUDGE US BY THE COMPANY WE KEEP

licensing services in the fields of integrated circuits, computer chip packaging, computer chip interconnection and computer related technology;

MICRO BGA

semiconductor chip and chip carrier;BGA;

MICROCONTACT

INTEGRATED CIRCUITS; PRINTED CIRCUIT BOARDS; SEMICONDUCTOR CHIP and CHIP CARRIER; ELECTRICAL CONNECTORS; FLEXIBLE CIRCUITS AND FLEXIBLE CABLES;MICRO CONTACT;COMPUTER TECHNOLOGY LICENSING; ENGINEERING AND DESIGN SERVICES;

MICROPAC

computer hardware, namely a ball grid array of electrical connections between a chip and supporting substrate;MICRO PACK;

MICROPILR

INTEGRATED CIRCUITS; PRINTED CIRCUIT BOARDS; INTEGRATED CIRCUIT CHIP PACKAGES IN THE NATURE OF SEMICONDUCTOR CHIP HOUSINGS AND SEMICONDUCTOR CHIPS; INTEGRATED CIRCUIT PACKAGE CONNECTORS; COMPUTER HARDWARE; PRINTED CIRCUIT SUBSTRATES; FLEXIBLE PRINTED CIRCUITS;COMPUTER TECHNOLOGY LICENSING;DEVELOPMENT OF NEW TECHNOLOGY FOR THE FABRICATION OF INTEGRATED CIRCUITS, PRINTED CIRCUIT BOARDS AND INTEGRATED CIRCUIT CHIP PACKAGES; ENGINEERING SERVICES; DESIGN SERVICES IN THE FIELD OF COMPUTERS AND COMPUTER CHIPS;

MODULE READY

semiconductor and carrier in combination; circuit boards; circuit board layers; computer chips; semiconductor carriers; chip carriers; and electronic signal processing units; namely, computer signal processing units, high definition television signal processing units and telecommunication signal processing units;MODULE;

OPTIML

OPTIMAL;Licensing of intellectual property in the fields of opto-electronics and digital imaging;

OPTIML

OPTIMAL;DESIGN OF OPTICAL AND MICROOPTICAL COMPONENTS;

OPTIµL

The Greek characters in the mark transliterate to MU and this means MICRO in English.;Licensing of intellectual property in the fields of opto-electronics and digital imaging;

PYXIS

MULTI-DIE ELECTRONIC SUB-ASSEMBLIES, MULTI-CHIP MODULES, MULTI-CHIP PACKAGES AND INTEGRATED CIRCUITS ALL FOR USE AS COMPONENTS BY ELECTRONICS EQUIPMENT MANUFACTURERS TO ASSIST INFORMATION PROCESSING;

SEPARABLE CONTACTS

COMPUTER HARDWARE;COMPUTER TECHNOLOGY LICENSING;TESTING AND ANALYSIS OF COMPUTER CHIPS FOR OTHERS;

SHELLCASE

electronic and scientific apparatus, namely integrated circuits providing mechanical and environmental protection for computer systems and providing electrical connection of such computer systems to other computer systems;SHELL CASE;

SMART OBJECTS EVERYWHERE

SMART OBJECTS;Computer hardware and software design services for others and engineering services in the fields of computer hardware and software for others;

SOCKETSTRATE

computer hardware, namely a planar connector;SOCKET STRAIGHT;

SOE

Computer hardware and software design services for others and engineering services in the fields of computer hardware and software for others;

TCC

semiconductor chip and chip carrier;

TCMT

flexible circuits encased in mounting tape, namely, electronic circuits and computer circuits;

TESSERA

electronic signal processing units; namely, computer signal processing units, high definition television signal processing units, and telecommunication signal processing units;

TESSERA

[ semiconductor and carrier in combination; circuit boards; circuit board layers; computer chips; semiconductor carriers; and chip carriers ];design, development and fabrication of computer hardware;

TESSERA

Integrated circuits; computer software in the field of image processing; optical lenses; printed circuit boards; semiconductor chip housings and semiconductor chips in combination; semiconductor chips and optical lenses in combination; integrated optical systems for imaging comprised of integrated circuits and optical lenses; integrated optical systems for data manipulation comprised of optical lenses, optical filters, and optical mirrors;Computer technology licensing; intellectual property licensing;The wording TESSERA has no meaning in a foreign language.;Design of optical and micro optical components; design services in the field of computers and integrated circuits;

TESSERA

The mark consists of a square comprised of nine smaller squares with five smaller squares comprising a sideways chevron shape to the left.;Integrated circuits; computer software in the field of image processing; optical lenses; printed circuit boards; semiconductor chip housings and semiconductor chips in combination; semiconductor chips and optical lenses in combination; integrated optical systems for imaging comprised of integrated circuits and optical lenses; integrated optical systems for data manipulation comprised of optical lenses, optical filters, and optical mirrors;Color is not claimed as a feature of the mark.;Computer technology licensing; intellectual property licensing;The wording TESSERA has no meaning in a foreign language.;Design of optical and micro optical components; design services in the field of computers and integrated circuits;