Yield Engineering Systems, Inc.

ECOCLEAN

cleaning equipment for use in the manufacture of semiconductors; stripping equipment for use in the manufacture of semiconductors; plasma cleaning equipment for use in the manufacture of semiconductors;ECO CLEAN;

ECOCLEAN

Environment-friendly semiconductor manufacturing machines;ECO CLEAN;

ECOCOAT

Machines for precision treatment of surfaces, namely, environment-friendly monolayer thin film coating machines for application on semiconductor wafers; vapor deposition machines, namely, environment-friendly chemical vapor deposition machines for coating semiconductor wafers with thin films of materials;ECO COAT;

ECOCOAT

Chemical vapor deposition equipment, namely, environment-friendly chemical vapor deposition apparatus for use in research;ECO COAT;

EFR

Semiconductor manufacturing equipment; semiconductor substrate manufacturing equipment;

EFR

Semiconductor manufacturing machines; Semiconductor substrates manufacturing machines;

LP-III

Dehydration Unit for Use in Preparing Silicon Wafers for the Application of Photoresist;

PRIMAANNEAL

Semiconductor manufacturing machines;

PRIMAANNEAL

Semiconductor manufacturing equipment;

PRIMAMAG

Semiconductor manufacturing machines;

PRIMAMAG

Semiconductor manufacturing equipment;

PRIMATHERM

Semiconductor manufacturing machines;

PRIMATHERM

Semiconductor manufacturing equipment;

ULTRACOAT

vapor deposition machines for use in manufacturing semiconductors, microelectromechanical systems, and medical devices;ULTRA COAT;

ULTRACOAT

Chemical vapor deposition apparatus for use in research;ULTRA COAT;

VEROTHERM

Semiconductor manufacturing machines;

VEROTHERM

Semiconductor manufacturing equipment;

VERTABAKE

Curing machines, namely, vacuum curing machines for manufacturing semiconductors, microelectromechanical systems (MEMS), and medical devices;

VERTABAKE

Curing equipment;

VERTACURE

Curing machines for use in the manufacture of semiconductors, namely, vacuum curing machines for curing and degassing semiconductor wafers;VERTA CURE;

VERTACURE

Curing equipment for use in the manufacture of semiconductors;VERTA CURE;

YES

Ovens Used to Prepare Silicon Wafers for the Applications of Photoresist;

YES

The mark consists of the stylized characters YES. The upper left vertical line of the letter Y appears in the color lime green, the upper right vertical line of the letter Y appears in the color medium green and the base of the letter Y appears in the color teal. The top horizontal line of the letter E appears in the color lime green. The middle horizontal line of the letter E appears in the color medium green. The bottom horizontal line of the letter E appears in teal. The top portion of the letter S appears in the color lime green. The middle portion of the letter S appears in the color medium green. The bottom portion of the letter S appears in the color teal.;Semiconductor manufacturing machines; Cleaning machines, namely, machines for removing impurities and descumming residues from silicon wafers; Stripping machines, namely, machines for stripping photoresist layers from silicon wafers; Plasma cleaning machines, namely, machines using plasma to remove impurities and descum residues from silicon wafers; Coating machines, namely, monolayer thin film coating machines for applying thin films to silicon wafers, micro-electro-mechanical systems, optical glass, and biomedical devices; Chemical vapor deposition machines for applying thin films to silicon wafers, micro-electro-mechanical systems, optical glass, and biomedical devices; Vacuum curing machines, namely, machines with vacuum chambers for curing and degassing semiconductor wafers; Annealing machines, namely, machines with vacuum chambers for altering physical and chemical properties of metal, for use in the manufacture of semiconductors; Bonding machines, namely, thin film coating machines for applying adhesive films between silicon wafers;YIELD ENGINEERING SYSTEMS;The color(s) lime green, medium green, and teal is/are claimed as a feature of the mark.;