Nanometrics Incorporated

"CAL-PAC"

FILM THICKNESS REFERENCE STANDARDS FOR FILM THICKNESS MEASUREMENT INSTRUMENTS;CALPAC;CALIFORNIA PACK;

CALIPER INSIGHT

Metrology system consisting of an automated wafer handling system consisting of an XY theta stage and vertical axis drive for positioning the wafer, an optical imaging microscope and an image processing and control computer for the measurement of registration and overlay errors on semiconductor waters and similar substrates;CALIPER;

CALIPER MOSAIC

Metrology system, namely, an automated wafer handling system comprised of axis drives for positioning the wafer, an optical imaging microscope, and an image processing and control computer, for the measurement of registration and overlay errors on semiconductor wafers and similar substrates in the manufacturing process;CALIPER;

CWIKSCAN

ELECTRON MICROSCOPES AND PARTS THEREFOR;QUICKSCAN QUICK SCAN;

EPIC

metrology system for the analysis and determination of properties such as thickness and optical constants of films on samples such as semiconductor wafers using different optical technologies for film analysis such as Fourier Transform Infrared (FTIR), visible and ultraviolet (UV) reflectometry;

INTEGRATED METROLOGY

Thin film and wafer surface measurement and inspection products which are designed to fit inside or be mounted onto production equipment used in the manufacturing of integrated circuits, such as chemical mechanical polishers, chemical vapor deposition systems, and other related equipment;

INTOOL

Metrology and inspection systems for integration into semiconductor wafer, magnetic read-write head, and flat panel display processing and related equipment; such as, but not limited to, chemical mechanical polishers, chemical vapor deposition reactors, physical vapor deposition reactors, rapid thermal processors, wet and dry etchers, epitaxial reactors, ion implanters, material handlers, lithography track and exposure systems, and assemblies thereof;IN TOOL;

IVS

electronic measuring system comprising computer, digital image enhancement computer hardware, microscope, and edge detection computer software for measuring submicron critical dimension, overlay registration and contact holes in the production of computer chips;

LYNXWARE

Computer software for controlling the metrology measuring device modules that are attached to units that process semiconductor wafers;LYNX WARE;

MEASURE THIS

MEASUREMENT SYSTEMS FOR THE MICRO-ELECTRONIC INDUSTRIES FOR CRITICAL DIMENSION CONTROL, COMPRISING OPTICAL AND ROBOTIC COMPONENTS, NAMELY, MICROSCOPE LENSES, POLARIZERS, COMPUTER CONTROLLED MECHANICS AND COMPUTER SOFTWARE, FOR THE CONTROL OF ROBOTIC COMPONENTS AND OPTICAL RADIATION ANALYSIS;

METALSPEC

scientific instrument for film metrology applications, namely, metal thickness measuring apparatus, controlled by a computer, to measure deposits of metal on any surface;METAL SPEC;

METRA

ELECTRONIC INSPECTION APPARATUS FOR SEMICONDUCTORS;

METRASPEC

scientific measuring instrument used to measure critical dimensions, lithography overlay registration, film thickness, and analysis of film composition during microelectronics manufacturing such as the production of integrated circuits;

MIGHTYSPEC

A metrology tool for measuring the thickness, and analyzing the composition of certain films such as, but not limited to, polycrystalline films deposited on substrates including, but not limited to, semiconductor wafers, flat panel display substrates and magnetic head substrates, such film properties are determined by various methods such as, but not limited to, reflectometry, ellipsometry and interferometry;MIGHTY SPEC;

N,K EXPERT

software expert system for the automatic analysis of optical data, e;g;, reflectometry, ellipsometry, scatterometry, or any combination thereof, to determine film thicknesses and/or optical constants of materials; It is applicable to single films or multiple-film stacks on any sample;

NANOBALANCE

electronic weighing machine to measure the average amount of material added to or removed from a sample;NANO-BALANCE;

NANOCLP

Laser scanners and reflectometers for industrial inspection, namely metrology modules employing optical measuring techniques, particularly reflectometry and laser profiling to non-destructively monitor the surface profiles of samples of semiconductor wafers, flat panel displays and magnetic media;NANO CLIP;

NANOLINE

Electro-Optical Automatic Fine Line Width Measure Apparatus;

NANOLYNX

Apparatus for handling semi-conductor wafers designed to support multiple metrology measuring device modules;

NANOLYNX

Apparatus for handling semiconductor wafers designed to support multiple metrology measuring device modules;NANO LYNX; NANOMETRICS LYNX;

NANOMAGIC

computer software program for metrology and industrial machine control;NANO MAGIC;

NANOMETRA

Scientific instrument for metrology applications, namely, a metrology unit which is used to measure the critical dimensions and overlay registration achieved in submicron optical lithography;

NANOMETRICS

Electro-Optical Instruments for Measuring Microscopic Objects;Applicant disclaims the word Nanometrics apart from the mark as shown.;

NANOOCS

Overlay optical metrology systems comprised of measurement optics, wafer handling mechanisms and system control hardware and software for measuring the difference between two nearly coincident patterns on a sample, such as a semiconductor wafer, which patterns are formed by a process such as photolithography, and which patterns are overlaid, one on top of the other and the overlay difference or error may be fed back to the exposure system that created the patterns so that this difference may be corrected on future exposures;

NANOUDI

Metrology system for the detection and measurement of particles and defects comprised principally of low distortion optics, a high intensity broadband light source, high resolution detector, and image processing and defect detection software, that enables inspection of both the front and backside of a sample, particularly, a semiconductor wafer, mask, flat panel display, or magnetic substrate;

OCDSE

combination of optical metrology instruments for measuring such things as microscopic dimensions and film thickness features of samples, particularly, of semiconductor wafers, flat panel displays and magnetic media;

PREDICTIVE METRICS

Metrology products for optimizing manufacturing processes through the science of measurement;

PREDICTIVE METRICS

Metrology products, namely, optical instruments, namely, ellipsometers, reflectometers, interferometers, scatterometers, comparitors, darkfield imagers, brightfield imagers, aerial imagers, diffraction imagers and photoluminescent imagers for optimizing manufacturing processes through the science of measurement;PREDICTIVE;

SENTINEL

Optical inspection system for semiconductor wafers in various stages of processing, said system comprised of imaging cameras, optical filters, control computer, and monochromatic illumination source comprised of laser and LED light sensors, the foregoing used to illuminate semiconductor wafers by ultra violet, infra-red and visible light, and thereby to acquire a spatial or spatial/spectral image of the band-edge luminescence emitted by the wafer using an imaging camera;

SENTINEL

Optical inspection system for semiconductor wafers in various stages of processing, said system comprised of imaging cameras, optical filters, control computer, and monochromatic illumination source comprised of laser and LED light sensors, the foregoing used to illuminate semiconductor wafers by ultra violet, infra-red and visible light, and thereby to acquire a spatial or spatial/spectral image of the band-edge luminescence emitted by the wafer using an imaging camera;

SENTINEL PLI

Optical inspection system for silicon solar cell wafers in various stages of processing, said system comprised of imaging cameras, optical filters, control computer, and monochromatic illumination source comprised of laser and LED light sensors, the foregoing used to illuminate solar cell wafers with infra-red and visible light and thereby to acquire a spatial image of the band-edge luminescence emitted by the wafer using an imaging camera;SENTINEL PLY;PLI;

VERTEX

Optical inspection apparatus for inspection and measurement of semiconductor wafers and similar substrates in various stages of processing comprised of a control computer, software, automatic recipe controlled sample handling, monochromatic illumination sources, light sensors, cameras, optical filters, and monochrometers and spectrometers;

ZBEAM

Metrology apparatus for inspection of semiconductor wafers, substrates and lithographic masks including analysis of substrate and surface topology and defects;Z BEAM;

ZEE

ZIRCONIATED ELECTRON EMITTER GUN ELECTRON SOURCE;Z;

ZFECT

Computer software for use in inspecting semiconductor wafers, substrates and lithographic masks including analysis of substrate and surface topography and defects;